What is the Additional Feature ?

Name: CSD25402Q3A
Brand: Texas Instruments
SKU: CSD25402Q3A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments CSD25402Q3A

Part No.:: CSD25402Q3A

Manufacturer:: Texas Instruments

Package:: 8-VSONP (3x3.15)

Datasheet:: CSD25402Q3A.pdf

Description:: MOSFET P-CH 20V 76A 8VSON

In Stock:: 3741

Quantity:: Add To Cart

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CSD25402Q3A Specifications

Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
NexFET™
ProductStatus:
Active
FETType:
P-Channel
Technology:
MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss):
20 V
Current-ContinuousDrain(Id)@25°C:
76A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn):
1.8V, 4.5V
RdsOn(Max)@IdVgs:
8.9mOhm @ 10A, 4.5V
Vgs(th)(Max)@Id:
1.15V @ 250µA
GateCharge(Qg)(Max)@Vgs:
9.7 nC @ 4.5 V
Vgs(Max):
±12V
InputCapacitance(Ciss)(Max)@Vds:
1790 pF @ 10 V
FETFeature:
-
PowerDissipation(Max):
2.8W (Ta), 69W (Tc)
OperatingTemperature:
-55°C ~ 150°C (TJ)
MountingType:
Surface Mount

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CSD25402Q3A information

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CSD25402Q3A Typical application Circuitry

CSD25402Q3A

The CSD25402Q3A is a model from the NexFET™ series of power MOSFETs, which are renowned for their exceptional efficiency in power management and conversion. This series is specially designed to cater to a wide range of applications that require low on-resistance, high power density, and fast switching capabilities. The CSD25402Q3A stands out for its compact size and high-performance characteristics, making it an ideal choice for applications like DC-DC converters, power supplies, and space-constrained power management solutions.

1. Drain Pin (D): The Drain pin of the CSD25402Q3A is typically connected to the high voltage side of the load. In a high-side switch configuration, it's connected to the positive terminal of the load, and in a low-side switch configuration, it is connected to the ground.

2. Source Pin (S): The Source pin is another primary terminal of the MOSFET. In high-side switching, it connects to the negative side of the load, whereas in low-side switching, it's usually tied to the circuit's ground or a common reference point.

3. Gate Pin (G): The Gate pin is crucial for controlling the operation of the MOSFET. It should be connected to a gate driver circuit or a microcontroller output, where the voltage at the Gate pin determines the on/off state of the MOSFET.

4. Power Supply Connections: It's important to ensure that the voltage across the Drain and Source terminals does not exceed the maximum rating for the CSD25402Q3A to maintain safe operation.

5. Gate Drive Circuitry: A suitable gate drive circuit is essential for the MOSFET's efficient operation. This circuit should provide the necessary voltage and current to swiftly switch the MOSFET on and off.

6. Flyback Diode for Inductive Loads: In applications involving inductive loads, a flyback diode is recommended across the load to protect the MOSFET from voltage spikes due to inductive kickback.

7. Thermal Management: Effective heat dissipation, such as using heatsinks, is important in high-current or high-frequency switching applications to prevent overheating of the MOSFET.

8. PCB Layout Design: The PCB layout should minimize resistance and inductance in the paths connecting the Drain, Source, and Gate terminals. Additionally, the layout should support the current handling and thermal dissipation needs of the MOSFET.

In summary, the CSD25402Q3A from the NexFET™ MOSFET series is optimized for applications that demand efficient power conversion and space-saving design. Proper implementation involves accurate connections for the Drain, Source, and Gate, appropriate power supply configuration, gate driving, protection for inductive loads, efficient thermal management, and a carefully planned PCB layout to ensure optimal performance and reliability in power management systems.

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