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Name: CSD87350Q5D
Brand: Texas Instruments
SKU: CSD87350Q5D
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments CSD87350Q5D

Part No.:: CSD87350Q5D

Manufacturer:: Texas Instruments

Package:: 8-PowerLDFN

Datasheet:: CSD87350Q5D.pdf

Description:: MOSFET 2N-CH 30V 40A 8LSON

In Stock:: 3845

Quantity:: Add To Cart

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CSD87350Q5D Specifications

Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®,Bulk
Series:
NexFET™
ProductStatus:
Active
FETType:
2 N-Channel (Dual)
FETFeature:
Logic Level Gate
DraintoSourceVoltage(Vdss):
30V
Current-ContinuousDrain(Id)@25°C:
40A
RdsOn(Max)@IdVgs:
5.9mOhm @ 20A, 8V
Vgs(th)(Max)@Id:
2.1V @ 250µA
GateCharge(Qg)(Max)@Vgs:
10.9nC @ 4.5V
InputCapacitance(Ciss)(Max)@Vds:
1770pF @ 15V
Power-Max:
12W
OperatingTemperature:
-55°C ~ 150°C (TJ)
MountingType:
Surface Mount

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CSD87350Q5D information

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CSD87350Q5D Typical application Circuitry

CSD87350Q5D

The CSD87350Q5D is a pivotal element of the renowned NexFET™ power block product line, celebrated for its advanced efficiency and power density in various electronic applications. This model is a dual N-Channel MOSFET, characterized by its exceptional efficiency in power conversion tasks. The CSD87350Q5D excels in applications such as synchronous buck converters, which are pivotal in PCs, servers, and telecom equipment, due to its proficient handling of high-density power requirements.

1. CSD87350Q5D Series' Distinguished Attributes: Marked by its superior power efficiency and thermal performance, the CSD87350Q5D sets itself apart with a low on-resistance and remarkable switching characteristics. These features are instrumental in minimizing power losses and enhancing overall system efficiency, particularly in space-constrained environments. The series is engineered to deliver high performance with minimal footprint, leveraging SON 5x6mm package technology to achieve an optimal balance between thermal performance and size.

2. Detailed Pin Configuration and Connectivity Insights: The CSD87350Q5D is encapsulated within an 8-pin SON package, designed with precision for enhanced system integration. The configuration includes two gate pins (pins 1 and 8) for the N-Channel MOSFETs, facilitating independent control. The source pins for the high-side and low-side MOSFETs are designated as pins 2, 3, 4 (high-side) and pins 5, 6, 7 (low-side), respectively. This arrangement simplifies the PCB layout and enhances the switching performance. The central pad underneath the package is crucial for thermal management and should be soldered to the PCB to ensure optimal heat dissipation.

3. Incorporating CSD87350Q5D into Circuit Architectures: To seamlessly integrate the CSD87350Q5D into a circuit, attention must be given to the gate drive circuits for each MOSFET, ensuring they are correctly interfaced with the gate pins. The source and drain connections must align with the circuit's power flow requirements, taking into account the high-side and low-side configurations. Proper decoupling and layout techniques are paramount to mitigate parasitic inductances and capacitances, which could otherwise impact the MOSFET's performance.

4. Maximizing CSD87350Q5D Efficiency: Achieving peak efficiency with the CSD87350Q5D involves meticulous attention to the PCB layout, particularly in the placement of the power block relative to the critical components of the power supply circuit. Optimizing the gate drive circuitry to ensure fast and robust switching, along with careful selection of external components that match the MOSFET's characteristics, are crucial steps. Ensuring the thermal pad is well-integrated into the PCB design is essential for maintaining thermal performance and device reliability.

5. Design Strategies Emphasizing CSD87350Q5D Utilization: Strategic design with the CSD87350Q5D involves considering the power block's placement to minimize loop inductance and resistance in the power path. The arrangement of the gate drive paths, along with the power and ground planes, should be optimized to support fast switching transients while minimizing interference. The thermal management strategy should prioritize effective heat dissipation to sustain the device's performance under various operating conditions.

6. CSD87350Q5D Deployment Scenarios: The CSD87350Q5D's adaptability makes it an ideal candidate for a wide array of applications where power efficiency and density are critical. Its utility in synchronous buck converter designs, particularly in compact and high-performance computing and telecommunication hardware, underscores its ability to streamline power management in advanced electronic systems.

In essence, the CSD87350Q5D from the NexFET™ power block lineup emerges as a sophisticated solution for managing power in intricate electronic setups. Its attributes, such as low on-resistance and advanced thermal management, render it a top selection among engineers. A meticulous approach to the design and integration of this power block, emphasizing the careful arrangement of pins, control logic, and PCB layout, is vital. This ensures the CSD87350Q5D delivers its full capability, thereby amplifying the efficiency and dependability of the electronic system it powers.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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