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Name: MCP23S17T-E/ML
Brand: Microchip Technology
SKU: MCP23S17T-E/ML
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Microchip Technology MCP23S17T-E/ML

Part No.:: MCP23S17T-E/ML

Manufacturer:: Microchip Technology

Package:: 28-VQFN Exposed Pad

Datasheet:: MCP23S17T-E/ML.pdf

Description:: IC I/O EXPANDER SPI 16B 28QFN

In Stock:: 2996

Quantity:: Add To Cart

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MCP23S17T-E/ML Specifications

Package/Case:
28-VQFN Exposed Pad
Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
-
ProductStatus:
Active
NumberofI/O:
16
Interface:
SPI
InterruptOutput:
Yes
Features:
POR
OutputType:
Push-Pull
Current-OutputSource/Sink:
25mA
ClockFrequency:
10 MHz
Voltage-Supply:
1.8V ~ 5.5V
OperatingTemperature:
-40°C ~ 125°C
MountingType:
Surface Mount

MCP23S17T-E/ML this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MCP23S17T-E/ML price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MCP23S17T-E/ML to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MCP23S17T-E/ML information

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MCP23S17T-E/ML Typical application Circuitry

MCP23S17T-E ML

The MCP23S17T-E/ML is a proficient 16-bit I/O expander endowed with the capability of utilizing the SPI protocol, making it a sought-after solution for augmenting I/O pins, especially in constrained environments.

Applicability

It's notably applied in settings like smart home systems, embedded control interfaces, and instances where multiple I/O interfaces are a necessity without burdening the central controller.

Notable Features

- I/O Augmentation: 16 additional I/O pins are provided.

- Communication: Employs SPI for effective and fast communication.

- Voltage Operational Spectrum: It's versatile, functioning within a 1.8V to 5.5V range.

- Package Format: It is encapsulated in a QFN package.

Application Illustration: Embedded Control Interface

In a scenario of an embedded control interface, the MCP23S17T-E/ML shines in extending I/O capabilities, ensuring a responsive and intricate control mechanism.

Detailed Pin Connection

1. Power Configuration:

- Engagement: Associate pin 9 (VDD) with the embedded system's power rail. Validate the voltage compatibility to evade malfunctions.

- Security: Integrate overvoltage protection mechanisms to enhance the chip's safety.

2. Ground Establishment:

- Initiation: Incorporate pin 10 (VSS) into the embedded system's ground to foster electrical equilibrium.

- Role: This is quintessential for the standardization of voltage levels across the system.

3. SPI Interface Set-Up:

- Formation: Link pin 12 (SI) to the system's MOSI and pin 14 (SO) to MISO to invigorate the SPI communication pathway.

- Consideration: The quality of connections should be optimized to preclude signal degradation.

4. Address Configuration:

- Determination: Utilize pins 15-17 (A0, A1, A2) to articulate the address of MCP23S17T-E/ML, essential when multiple chips are operational.

- Strategy: The assignment of distinct addresses obviates communication ambiguities.

5. I/O Connectivity:

- Integration: Employ pins 1-8 and 18-25 for the attachment to various control elements within the embedded interface.

- Planning: Systematic allocation of pins is pivotal, taking into account the nature (input/output) of each connected element.

Design Focal Points

When engraining MCP23S17T-E/ML, attention pivots to:

1. Signal Preservation:

- Maintenance: Foster the conservation of SPI signals' quality, focusing on impeccable connections and minimal interference exposure.

- Arrangement Tactics: Deft arrangement of lines to subdue cross-talk is crucial.

2. EMI Shielding:

- Protection: Elevate electromagnetic interference shields, especially in environments with intricate electronic activities.

- Tactical Positioning: Situate sensitive pathways away from potential interference origins.

3. Power Reliability:

- Consistency: The power supplied to MCP23S17T-E/ML should epitomize reliability and steadiness.

- Safety Protocols: Incorporate voltage regulation and protective elements against surges.

The MCP23S17T-E/ML's inclusion in embedded control interfaces exemplifies a synergy of enhanced control, responsiveness, and adaptability. Precision in connection protocols and focusing on pivotal design elements promises a system that is efficient, reliable, and tailored to nuanced operational exigencies. This accentuates the adaptability and precision integral in contemporary embedded control landscapes.

MCP23S17T-E/ML FAQ

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6. What is the process for return or replacement of MCP23S17T-E/ML?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MCP23S17T-E/ML.

(3)The PartNo is unused and only in the original unpacked packaging.

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