STM32WB55RGV6

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STMicroelectronics STM32WB55RGV6

Part No.:
STM32WB55RGV6
Manufacturer:
STMicroelectronics
Package:
68-VFQFN Exposed Pad
Datasheet:
STM32WB55RGV6.pdf
Description:
ULTRA-LOW-POWER DUAL CORE ARM CO
In Stock:
2697
Quantity:
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  • Purchase and inquiryPurchase and inquiry

    STM32WB55RGV6 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including STM32WB55RGV6 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for STM32WB55RGV6 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    STM32WB55RGV6 Typical application Circuitry

    STM32WB55RGV6


    STMicroelectronics' STM32WB line of microcontrollers includes the STM32WB55RGV6. This particular device is equipped with both a microcontroller and a Bluetooth 5.0 & IEEE 802.15.4 (Zigbee & Thread) radio, making it an attractive choice for wireless communication applications.

    STM32WB55RGV6 Features:

    1. Dual-core system: An Arm Cortex-M4 for application processing and an Arm Cortex-M0+ for radio and BLE stack processing.

    2. Wireless Connectivity: Integrated Bluetooth 5.0 and IEEE 802.15.4 radio.

    3. Memory: 1MB of Flash memory and 256KB of RAM.

    4. Peripherals: ADC, DAC, PWM, UARTs, SPIs, I2Cs, GPIOs, and more.

    5. Security: Hardware encryption, secure firmware installation, Secure Boot, Secure Firmware Update.

    6. Energy Efficient: Designed for low-power applications with several power modes to maximize battery life.

    Applications:

    STM32WB55RGV6 can be applied to a wide range of scenarios, including smart home devices, wearable health devices, industrial sensors, and other IoT devices that require wireless communication.

    For our purposes, let's consider an example application: A smart home temperature sensor using Bluetooth 5.0 to transmit data to a central hub.

    Circuit Connection:

    1. Power Supply:

    - STM32WB55RGV6 VDD pin: Connect this to a 3.3V power source.
    - STM32WB55RGV6 VSS (ground) pin: Connect this to the power source's ground.

    2. Bluetooth Antenna:

    - STM32WB55RGV6 RF pin: Connect this pin to an appropriate 2.4GHz antenna. Depending on your range requirements, this could be a PCB antenna or an external antenna.

    3. Temperature Sensor (e.g., DS18B20):

    - Connect the data line of DS18B20 to any free GPIO pin on the STM32WB55RGV6, for instance, PA1.
    - Connect VDD of DS18B20 to 3.3V and GND to ground.
    - A pull-up resistor (typically 4.7k ohms) is needed between the data line and VDD.

    4. LED Indicator (optional):

    - An LED can be connected to any free GPIO (e.g., PA5) for indicating successful data transmission or for debugging purposes.
    - Don't forget a current-limiting resistor (e.g., 220 ohms) in series with the LED.

    5. Programming and Debugging:

    - Connect the SWDIO and SWCLK pins of STM32WB55RGV6 to a compatible ST-Link programmer/debugger.

    Design Considerations:

    1. Power Consumption: Considering it's a smart home application, power efficiency is crucial. The STM32WB55RGV6's low-power modes should be leveraged appropriately.

    2. Antenna Design: For optimal Bluetooth performance, the antenna design and placement are critical. Consider possible interference sources and obstacles.

    3. Firmware Security: Given the security features on the STM32WB55RGV6, one should ensure the firmware is secure, especially if it's an IoT application.

    4. Physical Enclosure: Ensure that the enclosure doesn't interfere with the Bluetooth signal. Materials like metal can hinder wireless performance.

    In conclusion, the STM32WB55RGV6 offers a robust platform for wireless communication applications, especially for IoT devices. Proper consideration to design elements can ensure optimal performance in real-world scenarios.

    STM32WB55RGV6 informationSTM32WB55RGV6 information

    STM32WB55RGV6 FAQ

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    6. What is the process for return or replacement of STM32WB55RGV6?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the STM32WB55RGV6 we delivered, we will accept the replacement or return of the STM32WB55RGV6 only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of STM32WB55RGV6.

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