EFR32MG21A020F1024IM32-BR

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Silicon Labs EFR32MG21A020F1024IM32-BR

Part No.:
EFR32MG21A020F1024IM32-BR
Manufacturer:
Silicon Labs
Package:
32-VFQFN Exposed Pad
Datasheet:
EFR32MG21A020F1024IM32-BR.pdf
Description:
IC MCU 2.4G 20DB MULTIPROTOCOL
In Stock:
3586
Quantity:
  Add To Cart
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    EFR32MG21A020F1024IM32-BR this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EFR32MG21A020F1024IM32-BR price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EFR32MG21A020F1024IM32-BR to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    EFR32MG21A020F1024IM32-BR Typical application Circuitry

    EFR32MG21A020F1024IM32-BR

    The EFR32MG21A020F1024IM32-BR is a highly integrated, multi-protocol wireless SoC (System on Chip) from Silicon Labs' EFR32 Mighty Gecko Series 2 family. This chip is designed for use in energy-efficient and secure IoT applications, making it particularly well-suited for connected home, industrial IoT, and smart energy solutions.

    Key Features and Specifications:

    - Core: ARM Cortex-M33 processor, providing enhanced computational performance and efficiency.

    - Memory: 1024 KB of flash memory and 96 KB of RAM, suitable for complex IoT applications requiring substantial code and data storage.

    - Wireless Capability: Supports Bluetooth Low Energy (BLE), Zigbee, Thread, and proprietary 2.4 GHz protocols, offering robust connectivity options for various wireless applications.

    - Security Features: Advanced security capabilities including a dedicated security core, secure boot, and hardware cryptographic accelerators to ensure data protection and secure communications.

    - Energy Efficiency: Ultra-low power consumption modes and fast wake-up times, optimized for battery-powered applications.

    - Package: Available in a compact QFN32 package, providing a small footprint for space-constrained IoT devices.

    Application Scenario: Smart Home Lighting Control System

    In a smart home lighting control system, the EFR32MG21A020F1024IM32-BR can be utilized to manage wireless communication between smart light bulbs and a central hub, as well as to handle user inputs from a smartphone app or physical switches.

    Circuit Design Methodology:

    1. Power Supply Connection (VDD, GND):

    - VDD: Connect the VDD pins to a stable and regulated 3.3V power supply. Include bypass capacitors close to the power pins to filter out noise and ensure a stable operation.

    - GND: All ground pins should be connected to the system's ground plane to enhance circuit stability and reduce noise.

    2. Antenna Design for Wireless Communication (RF Pin):

    - RF Pin: Connect the RF output/input pin to a 2.4 GHz antenna through an impedance-matching network. The antenna design should be optimized for performance within the enclosure of the device to ensure effective wireless communication.

    3. Interface with External Components (GPIO Pins):

    - GPIO Pins: Utilize GPIO pins to interface with LED drivers and switches. Implement input debouncing for switches and appropriate current driving capability for LEDs.

    4. Communication Interfaces (USART, I2C, SPI Pins):

    - USART: Configure USART for debugging or for communication with other peripheral devices within the smart home system.

    - SPI/I2C: Use SPI or I2C for interfacing with additional sensors or memory modules, if required for enhanced functionalities like ambient light detection or scene management.

    5. Programming and Debugging Interface (SWDIO, SWCLK Pins):

    - SWDIO and SWCLK: These pins should be accessible for connection to a debugger for programming the SoC and for conducting real-time diagnostics during development and maintenance.

    Design Considerations:

    - EMI and Signal Integrity: Given the wireless nature of the application, design the PCB to minimize electromagnetic interference and ensure good signal integrity, particularly around the antenna and high-speed signal paths.

    - Thermal Management: Monitor the thermal profile in the application, especially if enclosed in a non-ventilated area. While the SoC is low power, accumulated heat from other components like LED drivers might necessitate heat sinking or ventilation.

    - Power Management: Implement efficient power management strategies to optimize battery life, which is crucial in wireless IoT devices. This might include dynamic power scaling and effective power gating of unused peripherals.

    - Security Implementation: Leverage the hardware security features of the EFR32MG21A020F1024IM32-BR to protect user data and prevent unauthorized access, especially when interfacing with open networks like the internet.

    - Scalability and Firmware Updates: Design the system to be scalable and capable of receiving firmware updates wirelessly to accommodate future enhancements and security patches.

    Utilizing the EFR32MG21A020F1024IM32-BR in a smart home lighting control system effectively showcases its ability to integrate into a complex, multi-device environment, providing robust control, connectivity, and security features critical for modern IoT applications. This setup demonstrates the SoC's strengths in facilitating sophisticated and user-friendly smart home solutions.

    EFR32MG21A020F1024IM32-BR informationEFR32MG21A020F1024IM32-BR information

    EFR32MG21A020F1024IM32-BR FAQ

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    6. What is the process for return or replacement of EFR32MG21A020F1024IM32-BR?

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    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of EFR32MG21A020F1024IM32-BR.

    (3)The PartNo is unused and only in the original unpacked packaging.

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    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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