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Name: MCP37211T-200I/TE
Brand: Microchip Technology
SKU: MCP37211T-200I/TE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Microchip Technology MCP37211T-200I/TE

Part No.:: MCP37211T-200I/TE

Manufacturer:: Microchip Technology

Package:: 121-TFBGA

Datasheet:: MCP37211T-200I/TE.pdf

Description:: IC ADC 12BIT PIPELINED 121TFBGA

In Stock:: 3110

Quantity:: Add To Cart

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MCP37211T-200I/TE Specifications

Packaging:
Tape & Reel (TR)
Series:
-
Product Status:
Active
Number of Bits:
12
Sampling Rate(PerSecond):
200M
Number of Inputs:
1, 2, 4, 8
Input Type:
Differential
Data Interface:
LVDS - Parallel, Parallel
Configuration:
MUX-S/H-ADC
Ratio-S/H:ADC:
1:1
Number of A/D Converters:
1
Architecture:
Pipelined
Reference Type:
Internal
Voltage-Supply Analog:
1.14V ~ 1.26V, 1.71V ~ 1.89V
Voltage-Supply Digital:
1.14V ~ 1.26V, 1.71V ~ 1.89V
Features:
-
Operating Temperature:
-40°C ~ 85°C

MCP37211T-200I/TE this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MCP37211T-200I/TE price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MCP37211T-200I/TE to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MCP37211T-200I/TE information

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MCP37211T-200I/TE Application Introduction

MCP37211T-200I/TE is a high-precision 20-bit ADC (Analog-to-Digital Converter) commonly used in industrial and instrumentation applications for accurate analog signal acquisition.

Application Scenario:

In a data acquisition system, MCP37211T-200I/TE can be utilized to digitize analog signals from sensors, such as temperature sensors, pressure transducers, or strain gauges, for further processing and analysis.

Circuit Design:

To effectively use MCP37211T-200I/TE in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage and current supply to MCP37211T-200I/TE and associated circuitry. Utilize low-dropout voltage regulators and decoupling capacitors near the ADC to minimize noise and ensure accurate conversions.

2. Signal Integrity:

Design the PCB layout carefully to minimize noise, ground loops, and signal coupling effects. Keep analog and digital signal traces separate and use ground planes effectively to reduce interference and maintain signal integrity, especially around the MCP37211T-200I/TE.

3. Thermal Management:

Ensure proper thermal dissipation for MCP37211T-200I/TE to maintain optimal performance and reliability. Use thermal vias, heat sinks, or thermal pads to dissipate heat effectively, especially in high-temperature environments or during prolonged operation.

4. Analog Front-End:

Implement an optimized analog front-end circuitry to condition and amplify analog signals before feeding them into MCP37211T-200I/TE. Use precision amplifiers, filters, and impedance matching techniques to improve signal quality and maximize ADC accuracy.

5. Calibration and Testing:

Calibrate MCP37211T-200I/TE periodically to compensate for offset and gain errors, temperature variations, and other sources of inaccuracies. Perform thorough testing and validation of the entire system to ensure accurate analog-to-digital conversions and reliable performance in real-world conditions.

Considerations:

When designing with MCP37211T-200I/TE, pay attention to:

- ADC Resolution and Sampling Rate: Choose the appropriate resolution and sampling rate based on the application requirements to achieve the desired accuracy and response time.

- Input Voltage Range: Ensure that the input signal range is within the specified limits of MCP37211T-200I/TE to prevent overloading or damage to the ADC.

- EMI/EMC Compliance: Design the circuit layout and shielding to minimize electromagnetic interference and ensure compliance with regulatory standards, especially in sensitive applications.

- System Integration: Integrate MCP37211T-200I/TE seamlessly into the overall system architecture, considering factors such as communication interfaces, microcontroller compatibility, and data processing requirements.

- Application-Specific Considerations: Customize the design and configuration of MCP37211T-200I/TE according to the specific requirements and constraints of the target application, such as accuracy, speed, power consumption, and environmental conditions.

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6. What is the process for return or replacement of MCP37211T-200I/TE?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MCP37211T-200I/TE we delivered, we will accept the replacement or return of the MCP37211T-200I/TE only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MCP37211T-200I/TE.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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