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Name: MCP33131D-10T-I/MN
Brand: Microchip Technology
SKU: MCP33131D-10T-I/MN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology MCP33131D-10T-I/MN

Part No.:: MCP33131D-10T-I/MN

Manufacturer:: Microchip Technology

Package:: 10-WFDFN Exposed Pad

Datasheet:

Description:: IC ADC 16BIT SAR 10TDFN

In Stock:: 3444

Quantity:: Add To Cart

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MCP33131D-10T-I/MN Specifications

Packaging:
Tape & Reel (TR)
Series:
Automotive, AEC-Q100
Product Status:
Active
Number of Bits:
16
Sampling Rate(PerSecond):
1M
Number of Inputs:
1
Input Type:
Differential, Pseudo-Differential, Single Ended
Data Interface:
SPI
Configuration:
ADC
Ratio-S/H:ADC:
0:1
Number of A/D Converters:
1
Architecture:
SAR
Reference Type:
External
Voltage-Supply Analog:
1.7V ~ 1.9V
Voltage-Supply Digital:
1.7V ~ 5.5V
Features:
-
Operating Temperature:
-40°C ~ 85°C

MCP33131D-10T-I/MN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MCP33131D-10T-I/MN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MCP33131D-10T-I/MN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MCP33131D-10T-I/MN information

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MCP33131D-10T-I/MN Application Introduction

MCP33131D-10T-I/MN is a high-resolution analog-to-digital converter (ADC) manufactured by Microchip Technology, offering 10-bit resolution and SPI interface for accurate analog signal digitization.

Application Scenario:

In sensor-based systems or data acquisition applications, MCP33131D-10T-I/MN can be utilized to convert analog signals, such as temperature, pressure, or voltage, into digital format for processing and analysis.

Circuit Design:

To effectively utilize MCP33131D-10T-I/MN in a design project, consider the following optimization techniques:

1. Power Management:

Ensure stable power supply to MCP33131D-10T-I/MN and associated components. Utilize low-noise voltage regulators and bypass capacitors near the ADC to minimize power supply-induced noise and ensure accurate conversion.

2. Signal Integrity:

Design the layout to minimize noise coupling and signal distortion. Keep analog and digital signal traces separated on the PCB, and use ground planes and shielding techniques to reduce electromagnetic interference (EMI) and maintain signal integrity during analog-to-digital conversion.

3. Thermal Management:

Ensure adequate thermal dissipation for MCP33131D-10T-I/MN to prevent overheating and maintain performance stability. Properly distribute heat sinks or thermal vias on the PCB, and ensure sufficient airflow in the enclosure if applicable.

4. Reference Voltage:

Provide a stable and accurate reference voltage to MCP33131D-10T-I/MN for precise conversion. Use precision voltage references and decoupling capacitors to minimize voltage fluctuations and ensure consistent ADC performance.

5. Layout and Grounding:

Follow best practices for PCB layout and grounding to minimize ground loops and stray capacitance. Place analog components and traces away from high-speed digital signals, and use star grounding topology to reduce noise coupling and maintain signal integrity.

Considerations:

When designing with MCP33131D-10T-I/MN, pay attention to:

- Clock Synchronization: Ensure proper synchronization between the ADC clock and the microcontroller or system clock to avoid timing skew and maintain accurate sampling.

- SPI Communication: Implement robust error checking and handling mechanisms in the SPI communication protocol to ensure data integrity and reliability during ADC operation.

- Calibration and Testing: Calibrate the ADC periodically to compensate for offset and gain errors, and perform comprehensive testing to verify ADC accuracy and performance across the operating range.

- Environmental Considerations: Consider the operating environment, such as temperature and humidity, and choose suitable packaging and enclosure designs to protect MCP33131D-10T-I/MN from external factors and ensure long-term reliability.

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6. What is the process for return or replacement of MCP33131D-10T-I/MN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MCP33131D-10T-I/MN we delivered, we will accept the replacement or return of the MCP33131D-10T-I/MN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MCP33131D-10T-I/MN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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