CC430F5137IRGZR

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Texas Instruments CC430F5137IRGZR

Part No.:
CC430F5137IRGZR
Manufacturer:
Texas Instruments
Package:
48-VFQFN Exposed Pad
Datasheet:
CC430F5137IRGZR.pdf
Description:
IC RF TXRX+MCU ISM<1GHZ 48VFQFN
In Stock:
3356
Quantity:
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  • Purchase and inquiryPurchase and inquiry

    CC430F5137IRGZR this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including CC430F5137IRGZR price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for CC430F5137IRGZR to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    CC430F5137IRGZR Typical application Circuitry Schematics

    CC430F5137IRGZR

    The CC430F5137IRGZR is a system-on-chip (SoC) device from Texas Instruments that integrates an MSP430 microcontroller with a low-power RF transceiver. This chip is widely used in low-power wireless applications. While the exact application circuit depends on your particular use case, here's a general idea of how to create an application circuit for the CC430F5137IRGZR: 

    1. Power Supply: The device typically operates at a supply voltage of 1.8V to 3.6V, provided to the DVCC and ACC pins. Bypass capacitors should be connected close to these pins for noise reduction. 

    2. RF Circuit: As the device includes a built-in RF transceiver, an RF matching circuit and an antenna are needed. The matching circuit, which typically includes components like inductors and capacitors, connects to the RF_P and RF_N pins, as does the antenna. The exact design of this circuit depends on the RF frequency used. 

    3. Crystal Oscillators: The CC430F5137IRGZR requires a 32.768 kHz crystal for the low-frequency oscillator (LFXT1), connected to the LFXT1IN and LFXT1OUT pins, and a high-frequency crystal for the high-frequency oscillator (HFXT1), connected to the XT2IN and XT2OUT pins. The exact frequency of the HF crystal depends on your application needs and RF frequency. 

    4. GPO: General purpose I/O pins can be used to interface with various peripherals as needed in your application, such as sensors, LEDs, buttons, etc. 

    5. Flash Memory: Flash memory is integrated on the chip, but if additional non-volatile memory is needed, it can be interfaced via SPI or I2C. 

    6. Reset Circuit: A reset push-button should be connected to the RST/NMI pin. 

    7. Debug Interface: The JTAG interface (TEST/BACK, TEST/STUDIO) can be used for programming and debugging. 

    8. Optional External Interrupts: External interrupts can be set up by configuring the P1.0 to P1.7 and P2.0 to P2.7 pins. 

    Remember to refer to the CC430F5137IRGZR data sheet and user's guide for a comprehensive understanding of the device specifications and design considerations. Texas Instruments also provides development boards and application notes which could be very useful in designing your own circuit. Always take into account your specific application requirements when designing your circuit.

    CC430F5137IRGZR informationCC430F5137IRGZR information

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    6. What is the process for return or replacement of CC430F5137IRGZR?

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    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of CC430F5137IRGZR.

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    (1)Inform us within 90 days

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