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Name: BC57E687C-GITB-E4
Brand: Qualcomm
SKU: BC57E687C-GITB-E4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Qualcomm BC57E687C-GITB-E4

Part No.:: BC57E687C-GITB-E4

Manufacturer:: Qualcomm

Package:: 169-TFBGA

Datasheet:: BC57E687C-GITB-E4.pdf

Description:: IC RF TXRX+MCU BLUTOOTH 169TFBGA

In Stock:: 2576

Quantity:: Add To Cart

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BC57E687C-GITB-E4 Specifications

Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
BlueCore5™ Multimedia
ProductStatus:
Not For New Designs
Type:
TxRx + MCU
RFFamily/Standard:
Bluetooth
Protocol:
Bluetooth v2.1 +EDR, Class 2 and 3
Modulation:
-
Frequency:
2.4GHz
DataRate(Max):
3Mbps
Power-Output:
8dBm
Sensitivity:
-90dBm
MemorySize:
48kB RAM
SerialInterfaces:
I²C, I²S, UART, USB
GPIO:
16
Voltage-Supply:
1.5V
Current-Receiving:
-
Current-Transmitting:
-
OperatingTemperature:
-
MountingType:
Surface Mount

BC57E687C-GITB-E4 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BC57E687C-GITB-E4 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BC57E687C-GITB-E4 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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BC57E687C-GITB-E4 information

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BC57E687C-GITB-E4 Typical application Circuitry

BC57E687C-GITB-E4 is a chip associated with the Bluetooth wireless communication protocol. Its primary functionality is to enable wireless communication for devices, particularly when integrated into embedded systems.

Functionality:

The BC57E687C-GITB-E4 acts as a bridge to facilitate wireless communication between devices. This capability is essential for applications that demand short-range data transfer without physical connections.

Application Scenarios:

Given its wireless capabilities, the BC57E687C-GITB-E4 is apt for various scenarios:

- Wireless audio devices, like headphones and speakers. - IoT devices that require data synchronization or transfer. - Home automation gadgets like smart bulbs and thermostats. - peripheral devices, including wireless mice and keyboards.

Parameter Features:

While I can't provide exhaustive specifics without the datasheet, typical parameters of such chips would include:

- Operating frequency (typically around 2.4 GHz for Bluetooth).

- Modulation techniques used. - Supported Bluetooth profiles (e.g., A2DP for audio streaming).

- Power consumption under different modes (transmit, receive, standby).

- Range or effective communication distance.

Circuit Integration:

Consider a use-case scenario of integrating this chip into a wireless audio speaker:

1. Powering the Chip: Pins like VCC and GND would need to be connected to a stable power source, typically 3.3V or as specified in the datasheet.

2. Audio Input: Analog audio input pins should be connected to the audio source, for instance, an onboard amplifier circuit or a DAC.

3. Antenna Connection: An external antenna might be needed to ensure optimal wireless reception. There will be specific pins on BC57E687C-GITB-E4 for antenna connections. It's vital to choose an appropriate antenna based on the desired range and environment.

4. Control Interface: GPIOs or other control pins would be connected to buttons or touch interfaces for functionalities like play, pause, or volume control.

5. Indicators: LED indicator pins can be hooked to LEDs to show connection status, battery level, or other critical indicators.

Design Considerations:

1. Power Management: Ensure efficient power management, especially if the device is battery-powered. When a device is not actively sending or receiving data, it should be used in sleep or low-power modes.

2. Interference: Given the crowded 2.4 GHz frequency, ensure the circuit minimizes interference with other wireless devices.

3. Antenna Placement: To provide the best transmission and reception, proper positioning is essential. It should be away from large metal objects or other components that can affect its performance.

4. Thermal Management: Continuous operation can generate heat. Proper heat dissipation methods should be incorporated if necessary.

5. Firmware Updates: The ability to update firmware can help in enhancing features or fixing potential bugs. Ensure the design allows for these updates.

In conclusion, integrating BC57E687C-GITB-E4 demands a good understanding of the Bluetooth protocol, the specific needs of the device it's being used in, and other factors like power management and interference considerations. The chip's datasheet would be invaluable for specific pin information and detailed functional aspects.

BC57E687C-GITB-E4 FAQ

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6. What is the process for return or replacement of BC57E687C-GITB-E4?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BC57E687C-GITB-E4 we delivered, we will accept the replacement or return of the BC57E687C-GITB-E4 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BC57E687C-GITB-E4.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations