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Name: XCZU9CG-2FFVC900I
Brand: Xilinx Inc.
SKU: XCZU9CG-2FFVC900I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XCZU9CG-2FFVC900I

Part No.:: XCZU9CG-2FFVC900I

Manufacturer:: Xilinx Inc.

Package:: 900-BBGA, FCBGA

Datasheet:: XCZU9CG-2FFVC900I.pdf

Description:: IC SOC CORTEX-A53 900FCBGA

In Stock:: 2077

Quantity:: Add To Cart

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XCZU9CG-2FFVC900I Specifications

Package/Case:
900-BBGA, FCBGA
Packaging:
Tray
Series:
Zynq® UltraScale+™ MPSoC CG
ProductStatus:
Active
Architecture:
MCU, FPGA
CoreProcessor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
FlashSize:
-
RAMSize:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 1.3GHz
PrimaryAttributes:
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCZU9CG-2FFVC900I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCZU9CG-2FFVC900I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCZU9CG-2FFVC900I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCZU9CG-2FFVC900I information

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XCZU9CG-2FFVC900I Typical application Circuitry

The XCZU9CG-2FFVC900I is a prominent module in the Xilinx Zynq UltraScale+ MPSoC family, characterized by its exceptional integration of a multi-core processor and FPGA (Field Programmable Gate Array) capabilities. This module is specifically engineered for high-performance applications in areas like data processing, embedded computing, and advanced signal processing.

1. Family and Features Overview: Within the Zynq UltraScale+ MPSoC family, the XCZU9CG-2FFVC900I distinguishes itself with a powerful combination of a 64-bit quad-core ARM Cortex-A53 processor and a 16nm FinFET+ programmable logic. This synergy makes it ideal for tasks requiring intensive computation and high flexibility in terms of hardware configuration.

2. Pin Configuration and Circuit Integration Specifics: The XCZU9CG-2FFVC900I has an extensive array of pins, each designated for specific functions such as power, grounding, signal input/output, and configuration. Correctly mapping and connecting these pins is crucial for the chip to operate efficiently. The power pins must be connected to a suitable power source, ensuring voltage levels match those specified in the XCZU9CG-2FFVC900I's datasheet. Signal pins need to be interfaced with corresponding components in the system, respecting the signal integrity and timing requirements.

3. Power Supply Considerations: The operation of the XCZU9CG-2FFVC900I hinges on a stable and adequate power supply. It is imperative to provide a power source that aligns with the module's specifications, as deviations can lead to suboptimal performance or potential damage. Attention should be given to the provision of clean and stable voltage inputs.

4. Signal Processing and Computational Capabilities: The core strength of the XCZU9CG-2FFVC900I lies in its dual capacity for advanced signal processing and computational tasks. Integrating this module into a system effectively leverages its ARM processors for complex computations, while the FPGA portion can be configured for specific, high-speed signal processing tasks.

5. Safety and Protection in Design: Implementing protective measures in circuits incorporating the XCZU9CG-2FFVC900I is recommended. Using components such as surge protectors and current-limiting resistors can help shield the module from electrical hazards, thereby enhancing its durability and reliability in demanding environments.

6. Strategic Placement for Thermal Management: Due to the high-performance nature of the XCZU9CG-2FFVC900I, managing heat generation is critical. Strategic placement within the system, ensuring adequate ventilation or employing active cooling solutions like heat sinks or fans, is key to maintaining optimal operating temperatures and preserving the module's longevity.

In conclusion, the XCZU9CG-2FFVC900I, as a part of the Zynq UltraScale+ MPSoC series, excels in applications that demand both high-speed signal processing and complex computation. Effective utilization of this module involves precise pin configuration, ensuring a stable power supply, leveraging its dual processing capabilities, incorporating safety measures in circuit design, and attentive thermal management. These considerations are integral to maximizing the potential of the XCZU9CG-2FFVC900I in advanced technological applications.

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6. What is the process for return or replacement of XCZU9CG-2FFVC900I?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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