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Name: XC7Z030-1FBG676C
Brand: Xilinx Inc.
SKU: XC7Z030-1FBG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC7Z030-1FBG676C

Part No.:: XC7Z030-1FBG676C

Manufacturer:: Xilinx Inc.

Package:: 676-BBGA, FCBGA

Datasheet:: XC7Z030-1FBG676C.pdf

Description:: IC SOC CORTEX-A9 667MHZ 676FCBGA

In Stock:: 3312

Quantity:: Add To Cart

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XC7Z030-1FBG676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7Z030-1FBG676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7Z030-1FBG676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7Z030-1FBG676C Typical application Circuitry

XC7Z030-1FBG676C

The XC7Z030-1FBG676C is a model within the Zynq-7000 family, a highly integrated SoC that merges the software programmability of an ARM-based processor with the hardware programmability of an FPGA. This dual capability makes it especially valuable for applications needing both high processing power and flexible hardware interaction. Here is how to effectively connect and utilize the XC7Z030-1FBG676C in your circuit design:

1. Power Supply Configuration: The XC7Z030-1FBG676C requires multiple power connections. Connect the VCCINT supply to pin AA24 for the internal FPGA logic, and the VCCPINT supply to pin U5 for the processor core. It's critical to ensure that these power supplies are stable and correctly filtered to maintain system reliability.

2. Processor System Reset: To initiate a system reset, connect a momentary switch between the PS_SRST_B pin (pin R4) and the ground. This will allow you to manually reset the processor system of the XC7Z030-1FBG676C whenever needed.

3. Configuration of I/O Pins: For general I/O configuration, connect your inputs or outputs to the available High-Range (HR) or High-Performance (HP) I/O banks. For example, the HP I/O bank can be accessed via pins like Y23 and Y24, which should be configured based on the voltage requirements specified in the XC7Z030-1FBG676C datasheet.

4. DDR3 Memory Interface: Connect DDR3 memory to the dedicated memory interface pins. For instance, connect the DQ lines of your DDR3 to pins V12 through V17. These connections are crucial for ensuring high-speed data transfer between the XC7Z030-1FBG676C and the memory module.

5. Programming and Configuration: To program the XC7Z030-1FBG676C, connect a JTAG interface to pins TCK (pin L10), TMS (pin L11), TDI (pin M13), and TDO (pin M14). This setup is necessary for loading configurations or programming the FPGA part of the SoC.

By following these detailed connection guidelines, you can effectively harness the capabilities of the XC7Z030-1FBG676C in your digital designs, benefiting from both its processing power and flexible FPGA architecture.

XC7Z030-1FBG676C information

XC7Z030-1FBG676C Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Zynq®-7000
ProductStatus:
Active
Architecture:
MCU, FPGA
CoreProcessor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
FlashSize:
-
RAMSize:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
PrimaryAttributes:
Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature:
0°C ~ 85°C (TJ)

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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