XCZU4CG-2FBVB900E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCZU4CG-2FBVB900E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCZU4CG-2FBVB900E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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1. Power Supply Connections: The XCZU4CG-2FBVB900E requires several power connections to ensure stable operation. Connect the main FPGA core voltage (VCCINT) to pins like V11, ensuring you follow the datasheet's guidelines for power sequencing and decoupling. The processor subsystem requires a separate power supply (VCC_PSINTLP), which should be connected to pins such as U10.
2. Ground Connections: Adequate grounding is crucial for minimizing electrical noise and ensuring stable operation. Connect all ground (GND) pins, including V10 and U11, to your system's ground plane.
3. Configuration and Boot Mode: The device configuration is initiated through the PROGRAM_B pin (e.g., T11), which resets the FPGA. Boot mode configuration, which dictates how the device loads its configuration (e.g., from flash memory or directly via JTAG), is set using specific pins such as M12 (MODE_PIN0).
4. Clock Inputs: Proper clocking is essential for system synchronization. Connect the system clock inputs for the ARM processors (CLK_PS) and the FPGA fabric (CLK_PL) to pins R10 and P11, respectively. These clocks should be sourced from stable, low-jitter oscillators to maximize device performance.
5. I/O Configuration: The XCZU4CG-2FBVB900E offers flexible I/O options configured to match the voltage and connectivity requirements of your application. High-speed I/O pins for serial transceivers, such as GTH transceivers at pins like R12 and P12, should be used for high-speed data transfer applications.
6. Thermal Management: Due to the processing power of the XCZU4CG-2FBVB900E, it can generate significant heat under load. It's critical to attach a heat sink or other cooling solutions directly to the package's thermal pad, and consider additional cooling strategies such as forced air or liquid cooling systems for intensive applications.
By adhering to these guidelines, you can successfully incorporate the XCZU4CG-2FBVB900E into your design, leveraging its robust processing capabilities and versatile programmable logic for complex and demanding technological applications.
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The price and inventory of XCZU4CG-2FBVB900E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU4CG-2FBVB900E we delivered, we will accept the replacement or return of the XCZU4CG-2FBVB900E only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XCZU4CG-2FBVB900E.
(3)The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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