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Name: XCZU3EG-2SFVC784I
Brand: Xilinx Inc.
SKU: XCZU3EG-2SFVC784I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XCZU3EG-2SFVC784I

Part No.:: XCZU3EG-2SFVC784I

Manufacturer:: Xilinx Inc.

Package:: 784-BFBGA, FCBGA

Datasheet:: XCZU3EG-2SFVC784I.pdf

Description:: IC SOC CORTEX-A53 784FCBGA

In Stock:: 3096

Quantity:: Add To Cart

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XCZU3EG-2SFVC784I Specifications

Package/Case:
784-BFBGA, FCBGA
Packaging:
Tray
Series:
Zynq® UltraScale+™ MPSoC EG
ProductStatus:
Active
Architecture:
MCU, FPGA
CoreProcessor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize:
-
RAMSize:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
PrimaryAttributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCZU3EG-2SFVC784I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCZU3EG-2SFVC784I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCZU3EG-2SFVC784I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCZU3EG-2SFVC784I information

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XCZU3EG-2SFVC784I Typical application Circuitry

The XCZU3EG-2SFVC784I is a member of the Zynq UltraScale+ MPSoC family from Xilinx, designed specifically for applications demanding high levels of processing power, security, and reliability. This device integrates a quad-core ARM Cortex-A53 CPU with a programmable FPGA logic, making it highly suitable for tasks in networking, automotive, defense, and industrial automation where versatile input/output options, secure data processing, and adaptable computing are required.

1. Power Supply Connections: For the XCZU3EG-2SFVC784I, multiple dedicated power supplies are required. Connect the main core power supply (VCCINT) to pin N12. The processor system power (VCC_PSINTLP) should be connected to pin M13. Ensure that each supply line is paired with the right decoupling capacitors as per the datasheet recommendations to ensure stability and reduce noise.

2. Grounding Scheme: It is essential to connect all ground (GND) pins, such as pins N11 and M11, to your system's ground. Proper grounding is crucial for minimizing noise and ensuring the overall integrity of electrical signals within the device.

3. Configuration and Boot Mode: The configuration of the XCZU3EG-2SFVC784I is critical for its functionality. Connect the PROGRAM_B pin (pin L14) to enable device configuration resetting. Boot mode settings can be adjusted through specific pins like MODE_PIN0 (pin M12), which determines the source of the configuration data (e.g., JTAG, Quad-SPI).

4. Clock Inputs: Clocking is vital for both the processor and the FPGA logic. Connect the primary system clock to the CLK_PS pin (pin K13) for the ARM cores and CLK_PL (pin J14) for the programmable logic. These clock sources must be stable and clean to avoid operational issues.

5. I/O Configurations: The XCZU3EG-2SFVC784I supports flexible I/O configurations that cater to a wide range of applications. Configure the high-speed and general-purpose I/O pins based on the voltage levels and signal requirements of your application. For example, high-speed transceiver lanes available on pins J12 and K12 should be used for applications needing fast data transfer, like high-definition video processing.

6. Thermal Management: Due to the power consumption and operational intensity of the XCZU3EG-2SFVC784I, managing heat is essential. Attach a heat sink or other cooling mechanisms directly to the thermal pad on the underside of the package. For environments with high ambient temperatures or where the device is under continuous heavy load, consider enhanced cooling solutions like forced air or liquid cooling.

By following these guidelines, the XCZU3EG-2SFVC784I can be effectively integrated into your project, leveraging its powerful dual capabilities of advanced ARM processing and flexible FPGA programming to meet the demands of sophisticated and critical applications.

XCZU3EG-2SFVC784I FAQ

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6. What is the process for return or replacement of XCZU3EG-2SFVC784I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU3EG-2SFVC784I we delivered, we will accept the replacement or return of the XCZU3EG-2SFVC784I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCZU3EG-2SFVC784I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations