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Name: XCZU17EG-2FFVC1760E
Brand: Xilinx Inc.
SKU: XCZU17EG-2FFVC1760E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XCZU17EG-2FFVC1760E

Part No.:: XCZU17EG-2FFVC1760E

Manufacturer:: Xilinx Inc.

Package:: 1760-BBGA, FCBGA

Datasheet:: XCZU17EG-2FFVC1760E.pdf

Description:: IC SOC CORTEX-A53 1760FCBGA

In Stock:: 3347

Quantity:: Add To Cart

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XCZU17EG-2FFVC1760E Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Zynq® UltraScale+™ MPSoC EG
ProductStatus:
Active
Architecture:
MCU, FPGA
CoreProcessor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize:
-
RAMSize:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
PrimaryAttributes:
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
OperatingTemperature:
0°C ~ 100°C (TJ)

XCZU17EG-2FFVC1760E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCZU17EG-2FFVC1760E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCZU17EG-2FFVC1760E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCZU17EG-2FFVC1760E information

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XCZU17EG-2FFVC1760E Typical application Circuitry

The XCZU17EG-2FFVC1760E is part of the Zynq UltraScale+ MPSoC family from Xilinx, designed for a blend of high-performance FPGA capabilities with multi-core ARM processing power. This model is particularly suitable for applications requiring intensive processing, such as video processing, automotive systems, and embedded AI. The XCZU17EG-2FFVC1760E combines FPGA programmability with the efficiency and scalability of processors, making it a powerful choice for system on chip (SoC) designs.

1. Power Supply Connection: This device requires multiple power connections. The main FPGA logic (VCCINT) should be connected to pin A175, and the processing system (VCC_PSINTLP) should connect to pin C175. Each power supply pin must be properly decoupled with the appropriate capacitors as specified in the datasheet to ensure stable operation.

2. Ground Connections: Ensuring that all ground pins, such as pin A176 and pin C176, are connected to the system's ground is crucial for reducing noise and avoiding signal integrity issues.

3. Configuration and Boot Mode Settings: The configuration of the XCZU17EG-2FFVC1760E can be managed through specific pins like the PROGRAM_B (pin D177), which resets the configuration logic, and pins for selecting boot mode (e.g., BOOT_MODE0 at pin B175). These settings determine how the device boots and from which source it loads its configuration.

4. Clock Inputs: Essential for the device's operation are the clock inputs. Connect a stable clock source to the primary clock pin (CLK_PS) on pin E176 for the processor system and another to CLK_PL (pin F177) for the programmable logic part of the MPSoC.

5. I/O Configuration: The XCZU17EG-2FFVC1760E features multiple configurable I/O pins. Ensure that these pins are connected according to the specific needs of your application, considering the voltage levels and the required data rates. High-speed transceiver lanes, for example, GTY transceivers, should be connected at dedicated pins such as G176 and H176.

6. Thermal Management: Due to its high-performance capabilities, the XCZU17EG-2FFVC1760E generates significant heat. It is critical to implement an effective thermal management strategy. Connect a heat sink directly to the thermal pad on the underside of the package, and consider additional cooling measures like forced air or liquid cooling if necessary.

By following these steps for the detailed connection of the XCZU17EG-2FFVC1760E, you can maximize the performance and reliability of this MPSoC in your projects, leveraging both its extensive processing capabilities and flexible programmable logic.

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6. What is the process for return or replacement of XCZU17EG-2FFVC1760E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU17EG-2FFVC1760E we delivered, we will accept the replacement or return of the XCZU17EG-2FFVC1760E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCZU17EG-2FFVC1760E.

(3)The PartNo is unused and only in the original unpacked packaging.

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