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Name: XCVU9P-3FLGA2577E
Brand: AMD Xilinx
SKU: XCVU9P-3FLGA2577E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCVU9P-3FLGA2577E

Part No.:: XCVU9P-3FLGA2577E

Manufacturer:: AMD Xilinx

Package:: 2577-BBGA, FCBGA

Datasheet:: XCVU9P-3FLGA2577E.pdf

Description:: IC FPGA 448 I/O 2577FCBGA

In Stock:: 2560

Quantity:: Add To Cart

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XCVU9P-3FLGA2577E Specifications

Package/Case:
2577-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
147780
NumberofLogicElements/Cells:
2586150
TotalRAMBits:
391168000
NumberofI/O:
448
NumberofGates:
-
Voltage-Supply:
0.873V ~ 0.927V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU9P-3FLGA2577E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU9P-3FLGA2577E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU9P-3FLGA2577E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU9P-3FLGA2577E information

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The application and technological advancement of XCVU9P-3FLGA2577E in specific industries

XCVU9P-3FLGA2577E is a highly advanced field-programmable gate array (FPGA) chip developed by Xilinx, offering unparalleled processing power and flexibility for demanding applications in various industries.

Application Scenario:

In the aerospace industry, XCVU9P-3FLGA2577E is revolutionizing onboard data processing and control systems, enabling faster and more efficient operation of spacecraft and satellites.

Circuit Design:

To harness the capabilities of XCVU9P-3FLGA2577E in aerospace applications, the circuit design must address the following key aspects:

1. Signal Processing:

Utilize the high-speed processing capabilities of XCVU9P-3FLGA2577E to handle complex algorithms for data compression, image processing, and signal modulation required in satellite communication systems.

2. Radiation Hardening:

Implement radiation-hardened designs to protect XCVU9P-3FLGA2577E from the harsh space environment, including ionizing radiation and high-energy particles, ensuring reliable operation throughout the mission lifespan.

3. Fault Tolerance:

Design redundancy and error-correction mechanisms within the circuit to mitigate the effects of single-event upsets (SEUs) and ensure continuous operation of critical systems, such as navigation and guidance.

4. Power Management:

Optimize power consumption and distribution within the spacecraft by employing efficient power management techniques and low-power modes of XCVU9P-3FLGA2577E to extend mission duration and reduce operational costs.

5. Communication Interfaces:

Integrate various communication interfaces, including high-speed serial transceivers and Ethernet controllers, to facilitate data exchange between XCVU9P-3FLGA2577E and other onboard subsystems, ground stations, and remote satellites.

Considerations:

When designing circuits with XCVU9P-3FLGA2577E for aerospace applications, it's crucial to consider:

- Reliability: Ensure the reliability and robustness of the circuit design to withstand the rigors of space missions and maintain operational integrity in extreme conditions.

- Thermal Management: Implement effective thermal management solutions to dissipate heat generated by XCVU9P-3FLGA2577E and prevent overheating, which could degrade performance and jeopardize mission success.

- Testing and Validation: Conduct comprehensive testing and validation procedures to verify the functionality, performance, and radiation tolerance of the circuit design before deployment in space missions.

- Compliance: Ensure compliance with industry standards and regulations, such as MIL-STD-883 for space-grade electronic components, to meet quality and reliability requirements for aerospace applications.

- Future Scalability: Design the circuit with scalability in mind to accommodate future upgrades and advancements in technology, allowing for seamless integration of new features and functionalities as mission requirements evolve.

XCVU9P-3FLGA2577E FAQ

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3. Are the XCVU9P-3FLGA2577E price and inventory displayed accurate?

The price and inventory of XCVU9P-3FLGA2577E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU9P-3FLGA2577E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU9P-3FLGA2577E we delivered, we will accept the replacement or return of the XCVU9P-3FLGA2577E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU9P-3FLGA2577E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations