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Name: XC3S400AN-4FTG256I
Brand: Xilinx Inc.
SKU: XC3S400AN-4FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Xilinx Inc. XC3S400AN-4FTG256I

Part No.:: XC3S400AN-4FTG256I

Manufacturer:: Xilinx Inc.

Package:: 256-LBGA

Datasheet:: XC3S400AN-4FTG256I.pdf

Description:: IC FPGA 195 I/O 256FTBGA

In Stock:: 3619

Quantity:: Add To Cart

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XC3S400AN-4FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Spartan®-3AN
ProductStatus:
Active
NumberofLABs/CLBs:
896
NumberofLogicElements/Cells:
8064
TotalRAMBits:
368640
NumberofI/O:
195
NumberofGates:
400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC3S400AN-4FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S400AN-4FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S400AN-4FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S400AN-4FTG256I information

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XC3S400AN-4FTG256I Typical application Circuitry

The XC3S400AN-4FTG256I is a robust FPGA from the Spartan-3AN series, a line of cost-effective FPGAs from Xilinx that integrate nonvolatile flash memory with enhanced functionality and improved operational efficiency. This specific model provides a medium-density solution with a rich feature set, making it ideal for applications in automotive, consumer electronics, and industrial control systems where secure storage and reliable operation are necessary.

1. Connecting Power Sources: Essential to the XC3S400AN-4FTG256I's operation is the accurate connection of power supplies to the designated pins. VCCINT, which powers the internal logic, VCCAUX for auxiliary functions, and VCCO for the output drivers, all require connection to the correct voltage levels as specified by the datasheet. Adequate decoupling capacitors should be placed near these pins to ensure stable operations.

2. Grounding the Device: For the XC3S400AN-4FTG256I, grounding is imperative. All GND pins must be connected to the system's ground plane to facilitate proper current return paths and to minimize electrical noise that could compromise the FPGA's performance.

3. Programming and Configuration Setup: To program the XC3S400AN-4FTG256I, the configuration pins such as PROGRAM_B, DIN, CCLK, and INIT_B must be interfaced correctly with a programming device. These connections are vital for feeding the configuration data into the FPGA to set up the device for its intended application.

4. I/O Pin Connections: With numerous I/O pins, the XC3S400AN-4FTG256I's versatility is noteworthy. Each I/O pin must be connected in accordance with the logic levels and signal requirements of the external components it communicates with, ensuring that the voltage levels are compatible and appropriately configured.

5. Implementing Clock Inputs: The XC3S400AN-4FTG256I requires a precise clock signal for timing operations. Connect the clock pins to a reliable external clock source, and utilize the FPGA's internal clock management features to distribute this signal as necessary throughout the device.

6. Thermal Management Considerations: Due to the XC3S400AN-4FTG256I's ability to handle dense logic operations, it can generate significant heat. A proper thermal management strategy, including heat sinks or forced air cooling, should be implemented to maintain optimal operating temperatures.

7. Signal Integrity Practices: The high-speed capabilities of the XC3S400AN-4FTG256I demand careful layout design. PCB traces should be matched in impedance, and where high-speed signals are concerned, proper termination techniques should be employed to avoid signal reflections.

By carefully addressing each aspect of power connection, grounding, configuration, I/O interfacing, clock signal management, thermal considerations, and signal integrity, the XC3S400AN-4FTG256I can be successfully integrated into a variety of electronic systems, unleashing its full potential for efficient and reliable performance in a multitude of applications.

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6. What is the process for return or replacement of XC3S400AN-4FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S400AN-4FTG256I we delivered, we will accept the replacement or return of the XC3S400AN-4FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S400AN-4FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations