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Name: XCVU9P-2FLGA2577E
Brand: AMD Xilinx
SKU: XCVU9P-2FLGA2577E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU9P-2FLGA2577E

Part No.:: XCVU9P-2FLGA2577E

Manufacturer:: AMD Xilinx

Package:: 2577-BBGA, FCBGA

Datasheet:: XCVU9P-2FLGA2577E.pdf

Description:: IC FPGA 448 I/O 2577FCBGA

In Stock:: 3410

Quantity:: Add To Cart

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XCVU9P-2FLGA2577E Specifications

Package/Case:
2577-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
147780
NumberofLogicElements/Cells:
2586150
TotalRAMBits:
391168000
NumberofI/O:
448
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU9P-2FLGA2577E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU9P-2FLGA2577E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU9P-2FLGA2577E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU9P-2FLGA2577E information

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The application and technological advancement of XCVU9P-2FLGA2577E in specific industries

XCVU9P-2FLGA2577E is a high-performance field-programmable gate array (FPGA) chip developed by Xilinx, offering unparalleled processing power and flexibility for a wide range of applications.

Application Scenario:

In the aerospace industry, XCVU9P-2FLGA2577E plays a pivotal role in enhancing onboard processing capabilities and enabling advanced functionalities in satellite systems.

Circuit Design:

To implement XCVU9P-2FLGA2577E in satellite systems, the following design considerations are crucial:

1. Payload Processing:

Integrate XCVU9P-2FLGA2577E to handle complex processing tasks for satellite payload data, including image processing, signal modulation, and data compression. Utilize the FPGA's massive parallel processing capability to enhance data throughput and processing speed.

2. Onboard Communication:

Utilize XCVU9P-2FLGA2577E to implement communication protocols for data transmission between the satellite and ground stations. Implement high-speed serial interfaces like PCIe or Ethernet to ensure reliable data transfer.

3. Radiation Hardening:

Design the satellite system with radiation-hardened components and techniques to withstand the harsh space environment. Employ fault-tolerant design methodologies and redundancy schemes to mitigate the effects of radiation-induced errors on XCVU9P-2FLGA2577E operation.

4. Power Efficiency:

Optimize power consumption of XCVU9P-2FLGA2577E by implementing dynamic power management techniques and clock gating strategies. Maximize energy efficiency to prolong satellite mission duration and reduce reliance on onboard power generation systems.

5. System Integration:

Integrate XCVU9P-2FLGA2577E with other satellite subsystems, such as attitude control, power distribution, and thermal management, to ensure seamless operation and coordination. Implement robust communication interfaces and data exchange protocols to facilitate inter-subsystem communication and coordination.

Considerations:

When incorporating XCVU9P-2FLGA2577E into satellite systems, it's essential to consider:

- Configuration Flexibility: Utilize the FPGA's reconfigurability to adapt to changing mission requirements and accommodate future upgrades.

- Thermal Management: Implement thermal design strategies to dissipate heat generated by XCVU9P-2FLGA2577E operation and maintain optimal operating temperatures in the satellite.

- Reliability Testing: Conduct rigorous testing and verification of the satellite system to ensure XCVU9P-2FLGA2577E functionality and reliability in the harsh space environment.

- Compliance with Standards: Ensure compliance with industry standards and regulations for satellite design, including electromagnetic compatibility (EMC) and reliability standards.

XCVU9P-2FLGA2577E FAQ

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3. Are the XCVU9P-2FLGA2577E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU9P-2FLGA2577E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU9P-2FLGA2577E we delivered, we will accept the replacement or return of the XCVU9P-2FLGA2577E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU9P-2FLGA2577E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations