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Name: XCVU9P-1FLGB2104I
Brand: AMD Xilinx
SKU: XCVU9P-1FLGB2104I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU9P-1FLGB2104I

Part No.:: XCVU9P-1FLGB2104I

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU9P-1FLGB2104I.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

In Stock:: 3586

Quantity:: Add To Cart

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XCVU9P-1FLGB2104I Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
147780
NumberofLogicElements/Cells:
2586150
TotalRAMBits:
391168000
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCVU9P-1FLGB2104I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU9P-1FLGB2104I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU9P-1FLGB2104I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU9P-1FLGB2104I information

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The application and technological advancement of XCVU9P-1FLGB2104I in specific industries

XCVU9P-1FLGB2104I is a high-performance field-programmable gate array (FPGA) designed by Xilinx, offering extensive capabilities for a wide range of applications. With its advanced features and robust design, XCVU9P-1FLGB2104I is revolutionizing various industries by enabling unprecedented levels of flexibility and performance.

Application Scenario:

In the aerospace industry, XCVU9P-1FLGB2104I plays a pivotal role in mission-critical systems, such as satellite communication, radar processing, and onboard computing. Its reconfigurability and high-speed processing capabilities make it ideal for handling complex algorithms and real-time data processing tasks in space exploration missions.

Circuit Design:

To harness the power of XCVU9P-1FLGB2104I in aerospace applications, designers must carefully plan and implement the following circuit design considerations:

1. Signal Processing:

Utilize the FPGA's programmable logic resources to implement custom signal processing algorithms for tasks such as radar signal filtering, spectral analysis, and waveform modulation/demodulation. Leverage the DSP slices and high-speed transceivers of XCVU9P-1FLGB2104I to achieve optimal performance.

2. Communication Interfaces:

Integrate various communication interfaces, including PCIe, Ethernet, and high-speed serial interfaces, to facilitate seamless data exchange between the FPGA and external systems, such as ground stations or other spacecraft modules. Configure the SERDES channels and protocol converters of XCVU9P-1FLGB2104I to meet the specific communication requirements of the mission.

3. Fault Tolerance:

Implement redundant processing paths and error correction mechanisms within the FPGA design to enhance the system's fault tolerance and reliability in harsh space environments. Utilize built-in self-test (BIST) features and triple modular redundancy (TMR) techniques to detect and mitigate potential failures.

4. Power Management:

Design efficient power supply and management circuits to ensure reliable operation of XCVU9P-1FLGB2104I while minimizing power consumption and heat dissipation. Implement dynamic power gating and voltage scaling techniques to optimize power usage based on the computational workload and environmental conditions.

5. Thermal Management:

Deploy advanced thermal management strategies, such as heat sinks, thermal vias, and thermal simulation tools, to mitigate the impact of thermal stress on XCVU9P-1FLGB2104I and surrounding components. Ensure proper airflow and heat dissipation mechanisms are integrated into the spacecraft's design to maintain optimal operating temperatures.

Considerations:

When designing FPGA-based systems for aerospace applications, it's essential to consider:

- Radiation Hardening: Implement radiation-hardened design techniques to mitigate the effects of cosmic radiation on FPGA functionality and reliability.

- Configuration Management: Establish robust configuration management procedures to ensure the integrity and security of FPGA bitstreams during deployment and operation.

- Compliance Standards: Adhere to industry-specific compliance standards and regulations, such as MIL-STD-883 and ECSS-Q-ST-60, to ensure the reliability and safety of FPGA-based aerospace systems.

- Test and Verification: Conduct thorough testing and verification procedures, including functional testing, environmental testing, and reliability testing, to validate the performance and reliability of the FPGA-based system under simulated mission conditions.

XCVU9P-1FLGB2104I FAQ

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6. What is the process for return or replacement of XCVU9P-1FLGB2104I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU9P-1FLGB2104I we delivered, we will accept the replacement or return of the XCVU9P-1FLGB2104I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU9P-1FLGB2104I.

(3)The PartNo is unused and only in the original unpacked packaging.

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