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Name: XCVU7P-3FLVB2104E
Brand: AMD Xilinx
SKU: XCVU7P-3FLVB2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCVU7P-3FLVB2104E

Part No.:: XCVU7P-3FLVB2104E

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU7P-3FLVB2104E.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

In Stock:: 3220

Quantity:: Add To Cart

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XCVU7P-3FLVB2104E Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
98520
NumberofLogicElements/Cells:
1724100
TotalRAMBits:
260812800
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.873V ~ 0.927V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU7P-3FLVB2104E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU7P-3FLVB2104E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU7P-3FLVB2104E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU7P-3FLVB2104E information

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The application and technological advancement of XCVU7P-3FLVB2104E in specific industries

XCVU7P-3FLVB2104E is a highly advanced field-programmable gate array (FPGA) tailored for demanding applications in sectors such as aerospace, defense, and telecommunications. It incorporates cutting-edge features and performance capabilities, revolutionizing industry standards and enhancing technological proficiency.

Application Scenario:

In aerospace applications, XCVU7P-3FLVB2104E serves as a cornerstone for complex systems such as flight control, avionics, and satellite communication. Its unparalleled processing power and customizable architecture enable the implementation of intricate algorithms and signal processing tasks required for mission-critical operations.

Circuit Design:

To harness the full potential of XCVU7P-3FLVB2104E in aerospace applications, follow these design considerations:

1. High-Speed Data Processing:

Utilize the high-speed transceivers and configurable logic resources of XCVU7P-3FLVB2104E to implement data processing pipelines for tasks such as radar signal processing, image recognition, and communication protocol handling.

2. Radiation Hardening:

Implement radiation-hardened design techniques to ensure the reliability of XCVU7P-3FLVB2104E in the harsh radiation environment encountered in space missions. This includes utilizing error-correction codes, triple modular redundancy (TMR), and latch-up protection mechanisms.

3. System Integration:

Integrate XCVU7P-3FLVB2104E with other components such as sensors, actuators, and communication interfaces to create a cohesive and responsive aerospace system. Utilize standard communication protocols like SpaceWire or MIL-STD-1553 for interoperability.

4. Power Management:

Optimize power consumption by utilizing dynamic voltage and frequency scaling (DVFS) techniques and power gating strategies. This ensures efficient utilization of power resources and extends the operational lifespan of XCVU7P-3FLVB2104E in battery-powered or energy-constrained applications.

5. Functional Safety:

Implement safety-critical functions using redundant logic paths and built-in self-test (BIST) capabilities of XCVU7P-3FLVB2104E to achieve compliance with industry standards such as DO-254 for airborne systems and ISO 26262 for automotive applications.

Considerations:

When designing with XCVU7P-3FLVB2104E, it's essential to address the following considerations:

- Thermal Management: Implement efficient cooling solutions to maintain XCVU7P-3FLVB2104E within its specified operating temperature range, especially in enclosed or high-temperature environments.

- Design Verification: Conduct thorough functional and performance verification tests to ensure the correctness and reliability of the FPGA-based system under various operating conditions and corner cases.

- Obsolescence Management: Plan for long-term availability and support of XCVU7P-3FLVB2104E by considering product lifecycle, obsolescence mitigation strategies, and potential migration paths to newer FPGA technologies.

XCVU7P-3FLVB2104E FAQ

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3. Are the XCVU7P-3FLVB2104E price and inventory displayed accurate?

The price and inventory of XCVU7P-3FLVB2104E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU7P-3FLVB2104E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU7P-3FLVB2104E we delivered, we will accept the replacement or return of the XCVU7P-3FLVB2104E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU7P-3FLVB2104E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations