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Name: XCVU45P-3FSVH2104E
Brand: AMD Xilinx
SKU: XCVU45P-3FSVH2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU45P-3FSVH2104E

Part No.:: XCVU45P-3FSVH2104E

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU45P-3FSVH2104E.pdf

Description:: IC FPGA 416 I/O 2104FCBGA

In Stock:: 3137

Quantity:: Add To Cart

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XCVU45P-3FSVH2104E Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
108960
NumberofLogicElements/Cells:
1906800
TotalRAMBits:
49597645
NumberofI/O:
416
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU45P-3FSVH2104E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU45P-3FSVH2104E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU45P-3FSVH2104E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU45P-3FSVH2104E information

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The application and technological advancement of XCVU45P-3FSVH2104E in specific industries

XCVU45P-3FSVH2104E is a highly advanced field-programmable gate array (FPGA) chip designed by Xilinx, tailored for demanding applications requiring high-performance computing and advanced signal processing capabilities.

Application Scenario:

In the aerospace industry, XCVU45P-3FSVH2104E plays a pivotal role in avionics systems, satellite communication, and radar signal processing, revolutionizing the way aircraft are controlled, monitored, and navigated.

Circuit Design:

To harness the power of XCVU45P-3FSVH2104E in aerospace applications, follow these design principles:

1. Sensor Integration:

Integrate various sensors, such as inertial measurement units (IMUs), GPS receivers, and radar sensors, with XCVU45P-3FSVH2104E to gather real-time data on aircraft position, velocity, and environmental conditions.

2. Signal Processing:

Utilize the high-performance DSP slices and flexible logic resources of XCVU45P-3FSVH2104E to implement complex signal processing algorithms for tasks like target tracking, terrain mapping, and communication signal modulation/demodulation.

3. Communication:

Implement communication interfaces, such as Ethernet, PCIe, and high-speed serial transceivers, to facilitate data exchange between XCVU45P-3FSVH2104E and other avionics subsystems, ground control stations, and satellite networks.

4. Redundancy and Fault Tolerance:

Utilize the redundancy features and built-in fault-tolerant mechanisms of XCVU45P-3FSVH2104E to ensure system reliability and resilience against hardware failures or environmental disturbances, critical for safety-critical aerospace applications.

5. Power Management:

Implement efficient power management schemes, such as dynamic voltage and frequency scaling (DVFS), to optimize power consumption and thermal performance of XCVU45P-3FSVH2104E in aerospace systems with stringent power constraints.

Considerations:

When designing with XCVU45P-3FSVH2104E, consider the following factors:

- Radiation Hardening: Ensure that the FPGA design and packaging meet radiation-hardened specifications to withstand the harsh radiation environment encountered in space applications.

- System Certification: Adhere to stringent aerospace standards, such as RTCA DO-254 for hardware design assurance and RTCA DO-178C for software considerations, to achieve certification for flight safety and regulatory compliance.

- Performance Optimization: Employ advanced optimization techniques, including parallelization, pipelining, and resource sharing, to maximize the computational efficiency and throughput of XCVU45P-3FSVH2104E in aerospace mission-critical tasks.

- Thermal Management: Implement effective thermal management solutions, such as heat sinks, fans, and thermal interface materials, to mitigate the risk of overheating and ensure reliable operation of XCVU45P-3FSVH2104E in high-temperature environments.

- System Integration and Testing: Conduct thorough integration testing and verification to validate the functionality, performance, and safety of the entire avionics system incorporating XCVU45P-3FSVH2104E, ensuring compliance with regulatory requirements and mission objectives.

XCVU45P-3FSVH2104E FAQ

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3. Are the XCVU45P-3FSVH2104E price and inventory displayed accurate?

The price and inventory of XCVU45P-3FSVH2104E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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5. How is the shipping arranged?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU45P-3FSVH2104E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU45P-3FSVH2104E we delivered, we will accept the replacement or return of the XCVU45P-3FSVH2104E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU45P-3FSVH2104E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations