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Name: XCVU3P-L2FFVC1517E
Brand: AMD Xilinx
SKU: XCVU3P-L2FFVC1517E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU3P-L2FFVC1517E

Part No.:: XCVU3P-L2FFVC1517E

Manufacturer:: AMD Xilinx

Package:: 1517-BBGA, FCBGA

Datasheet:: XCVU3P-L2FFVC1517E.pdf

Description:: IC FPGA 520 I/O 1517FCBGA

In Stock:: 2628

Quantity:: Add To Cart

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XCVU3P-L2FFVC1517E Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
49260
NumberofLogicElements/Cells:
862050
TotalRAMBits:
130355200
NumberofI/O:
520
NumberofGates:
-
Voltage-Supply:
0.698V ~ 0.742V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 110°C (TJ)

XCVU3P-L2FFVC1517E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU3P-L2FFVC1517E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU3P-L2FFVC1517E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU3P-L2FFVC1517E information

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XCVU3P-L2FFVC1517E application case analysis in emerging technology fields

XCVU3P-L2FFVC1517E is a high-performance FPGA chip manufactured by Xilinx, known for its versatility and advanced features. It offers immense computational power and flexible programmability, making it ideal for a wide range of applications in industries such as telecommunications, aerospace, and data centers.

Application Scenario:

In the field of telecommunications, XCVU3P-L2FFVC1517E can be utilized for accelerating signal processing tasks, such as modulation/demodulation, error correction, and channel encoding/decoding in high-speed communication systems.

System Architecture:

To harness the power of XCVU3P-L2FFVC1517E effectively, the system architecture should be carefully designed to maximize resource utilization and performance. Here's an overview:

1. Parallel Processing:

Exploit the parallel processing capabilities of XCVU3P-L2FFVC1517E by partitioning the computational tasks into smaller, independent units that can be executed simultaneously on different FPGA resources, such as logic cells, DSP slices, and memory blocks.

2. Pipelining:

Implement pipelining techniques to optimize throughput and reduce latency. Break down complex algorithms into stages and pipeline the data flow between them, allowing for continuous processing without idle cycles.

3. Custom IP Cores:

Develop custom IP cores tailored to the specific requirements of the application. Utilize Xilinx's Vivado development environment to design, simulate, and integrate these IP cores into the FPGA fabric, leveraging hardware acceleration for critical functions.

4. Memory Management:

Optimize memory usage and access patterns to minimize data movement and maximize bandwidth utilization. Utilize on-chip memory resources, such as block RAM and UltraRAM, for frequently accessed data and implement efficient memory interfaces for off-chip communication.

5. Power Efficiency:

Implement power-saving techniques, such as dynamic voltage and frequency scaling (DVFS) and clock gating, to reduce energy consumption while maintaining performance levels. Utilize Xilinx's Power Estimator tool to analyze power consumption and optimize the design accordingly.

Considerations:

When designing with XCVU3P-L2FFVC1517E, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources to achieve optimal performance and minimize resource contention.

- Timing Closure: Ensure that the design meets timing constraints to guarantee reliable operation at the desired clock frequency.

- Signal Integrity: Address signal integrity issues, such as skew, crosstalk, and reflection, to maintain data integrity and minimize errors in high-speed communication systems.

- Design Validation: Thoroughly validate the design through simulation, emulation, and hardware testing to ensure functionality, performance, and reliability before deployment.

- Scalability: Design the system with scalability in mind to accommodate future growth and evolving application requirements without significant redesign efforts.

XCVU3P-L2FFVC1517E FAQ

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We have a professional and experienced quality control team to strictly verify and test the XCVU3P-L2FFVC1517E. All suppliers must pass our qualification reviews before they can publish their products including XCVU3P-L2FFVC1517E on icwhale.com; we pay more attention to the channels and quality of XCVU3P-L2FFVC1517E products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XCVU3P-L2FFVC1517E price and inventory displayed accurate?

The price and inventory of XCVU3P-L2FFVC1517E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCVU3P-L2FFVC1517E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU3P-L2FFVC1517E we delivered, we will accept the replacement or return of the XCVU3P-L2FFVC1517E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU3P-L2FFVC1517E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations