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Name: XCVU3P-3FFVC1517E
Brand: AMD Xilinx
SKU: XCVU3P-3FFVC1517E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU3P-3FFVC1517E

Part No.:: XCVU3P-3FFVC1517E

Manufacturer:: AMD Xilinx

Package:: 1517-BBGA, FCBGA

Datasheet:: XCVU3P-3FFVC1517E.pdf

Description:: IC FPGA 520 I/O 1517FCBGA

In Stock:: 3260

Quantity:: Add To Cart

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XCVU3P-3FFVC1517E Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
49260
NumberofLogicElements/Cells:
862050
TotalRAMBits:
118067200
NumberofI/O:
520
NumberofGates:
-
Voltage-Supply:
0.873V ~ 0.927V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU3P-3FFVC1517E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU3P-3FFVC1517E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU3P-3FFVC1517E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU3P-3FFVC1517E information

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XCVU3P-3FFVC1517E application case analysis in emerging technology fields

XCVU3P-3FFVC1517E is an advanced FPGA (Field-Programmable Gate Array) device manufactured by Xilinx, offering unparalleled flexibility and performance for a wide range of applications. Its high logic density, superior processing capabilities, and versatile connectivity options make it the ultimate choice for demanding tasks.

Application Scenario:

In the realm of image processing and computer vision, XCVU3P-3FFVC1517E plays a pivotal role in accelerating complex algorithms and enabling real-time analysis. Let's delve into how this FPGA enhances efficiency and intelligence in such applications.

Algorithm Acceleration:

With its massive parallel processing architecture, XCVU3P-3FFVC1517E excels at accelerating image processing algorithms like convolutional neural networks (CNNs) and edge detection. By offloading computationally intensive tasks onto the FPGA, significant speedup and efficiency gains are achieved compared to traditional CPU-based implementations.

Customization and Adaptability:

One of the key advantages of XCVU3P-3FFVC1517E is its programmability, allowing developers to customize and optimize algorithms according to specific application requirements. This flexibility ensures that the FPGA can adapt to evolving needs and handle diverse image processing tasks efficiently.

Integration with Sensor Networks:

For applications involving sensor networks, XCVU3P-3FFVC1517E serves as a central processing hub, aggregating data from multiple sensors and performing advanced image analysis in real-time. Its high-speed interfaces facilitate seamless integration with various sensor technologies, enabling intelligent decision-making based on sensor inputs.

Energy Efficiency:

Despite its formidable processing capabilities, XCVU3P-3FFVC1517E is designed with energy efficiency in mind. Through careful power management techniques and dynamic reconfiguration capabilities, the FPGA optimizes energy consumption while maintaining peak performance, making it an ideal choice for battery-powered or resource-constrained applications.

Scalability and Future-Proofing:

As technology continues to evolve, XCVU3P-3FFVC1517E offers scalability and future-proofing for image processing applications. Its advanced architecture and support for emerging standards ensure compatibility with upcoming hardware and software advancements, providing a reliable foundation for long-term projects.

Considerations:

When deploying XCVU3P-3FFVC1517E in image processing applications, several factors should be taken into account:

- Resource Utilization: Optimize FPGA resources to maximize performance and minimize resource constraints.

- Real-Time Constraints: Ensure that image processing algorithms meet real-time deadlines to maintain responsiveness and accuracy.

- Interface Compatibility: Verify compatibility with external sensors, interfaces, and communication protocols to facilitate seamless integration.

- Heat Dissipation: Implement effective thermal management solutions to prevent overheating and ensure reliable operation in demanding environments.

- Algorithm Optimization: Continuously refine and optimize algorithms to leverage the full potential of XCVU3P-3FFVC1517E and adapt to changing application requirements.

XCVU3P-3FFVC1517E FAQ

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6. What is the process for return or replacement of XCVU3P-3FFVC1517E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU3P-3FFVC1517E we delivered, we will accept the replacement or return of the XCVU3P-3FFVC1517E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU3P-3FFVC1517E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations