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Name: XCVU3P-2FFVC1517E
Brand: Xilinx Inc.
SKU: XCVU3P-2FFVC1517E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Xilinx Inc. XCVU3P-2FFVC1517E

Part No.:: XCVU3P-2FFVC1517E

Manufacturer:: Xilinx Inc.

Package:: 1517-BBGA, FCBGA

Datasheet:: XCVU3P-2FFVC1517E.pdf

Description:: IC FPGA 520 I/O 1517FCBGA

In Stock:: 2992

Quantity:: Add To Cart

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XCVU3P-2FFVC1517E Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
49260
NumberofLogicElements/Cells:
862050
TotalRAMBits:
130355200
NumberofI/O:
520
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU3P-2FFVC1517E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU3P-2FFVC1517E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU3P-2FFVC1517E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU3P-2FFVC1517E information

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XCVU3P-2FFVC1517E Typical application Circuitry

The XCVU3P-2FFVC1517E is a high-performance FPGA from Xilinx's Virtex UltraScale+ series. It is engineered to deliver superior capabilities primarily in fields such as networking, data processing, and aerospace applications due to its extensive logic resources, high-speed transceivers, and advanced power management features. Here are detailed instructions on how to configure and connect this FPGA correctly, focusing on precise pin connections:

1. Power Supply Configuration: The XCVU3P-2FFVC1517E requires multiple power supplies for different parts of the chip. Connect the VCCINT pins to the internal power supply for the core logic. The VCCO pins must be connected to the power supply of each corresponding I/O bank. The VCCBRAM pins should be connected to the block RAM power supply. Ground (GND) pins should be connected throughout the board to ensure stability and reduce noise.

2. Configuration Interface Setup: For configuring the XCVU3P-2FFVC1517E, you can use the JTAG interface, which involves connecting the TDI (Test Data In), TDO (Test Data Out), TMS (Test Mode Select), and TCK (Test Clock) pins. Additionally, for serial configuration, connect the CCLK (Configuration Clock), CSB (Chip Select Bar), and DIN (Data In) pins.

3. Clocking Connections: Proper clocking is critical for the performance of the XCVU3P-2FFVC1517E. Connect your primary clock sources to the dedicated clock pins provided on the chip, such as MGTREFCLK for the transceivers and other system clocks. Use the internal clock management features like PLLs to derive multiple clock domains needed for your application.

4. I/O Pin Configuration: The XCVU3P-2FFVC1517E features numerous configurable I/O pins. Ensure that each I/O bank is correctly powered with its corresponding VCCO and has a clean ground connection. Match the logic levels of the I/O pins with the external devices they interface with to ensure signal integrity and proper function.

5. High-Speed Transceiver Setup: This FPGA includes several high-speed transceivers that need to be carefully configured. Ensure that the transceiver lanes are correctly terminated and matched with the impedance of the transmission medium to optimize performance and minimize data errors.

6. Thermal and Mechanical Considerations: Given the high power density of the XCVU3P-2FFVC1517E, effective cooling is essential. Attach a thermal sensor to the designated THERM pin and employ appropriate cooling solutions like heatsinks or liquid cooling systems to maintain operational temperatures within safe limits.

7. Debugging and Monitoring: Utilize the JTAG interface not just for programming but also for ongoing debugging and monitoring. This access allows for adjustments and real-time diagnostics crucial during development and testing phases.

By adhering to these specific guidelines, you can effectively utilize the XCVU3P-2FFVC1517E FPGA in your system, ensuring it operates efficiently and reliably within its designed parameters. Proper setup and configuration are essential for harnessing the full capabilities of this sophisticated FPGA technology.

XCVU3P-2FFVC1517E FAQ

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6. What is the process for return or replacement of XCVU3P-2FFVC1517E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU3P-2FFVC1517E we delivered, we will accept the replacement or return of the XCVU3P-2FFVC1517E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU3P-2FFVC1517E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations