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Name: XCVU27P-2FSGA2577I
Brand: AMD Xilinx
SKU: XCVU27P-2FSGA2577I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCVU27P-2FSGA2577I

Part No.:: XCVU27P-2FSGA2577I

Manufacturer:: AMD Xilinx

Package:: 2577-BBGA, FCBGA

Datasheet:: XCVU27P-2FSGA2577I.pdf

Description:: IC FPGA 448 I/O 2577FCBGA

In Stock:: 3003

Quantity:: Add To Cart

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XCVU27P-2FSGA2577I Specifications

Package/Case:
2577-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
162000
NumberofLogicElements/Cells:
2835000
TotalRAMBits:
74344038
NumberofI/O:
448
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCVU27P-2FSGA2577I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU27P-2FSGA2577I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU27P-2FSGA2577I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU27P-2FSGA2577I information

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The application and technological advancement of XCVU27P-2FSGA2577I in specific industries

XCVU27P-2FSGA2577I is a high-performance Field-Programmable Gate Array (FPGA) chip developed by Xilinx, offering exceptional processing power and flexibility for various applications in specialized industries. Equipped with advanced features and capabilities, XCVU27P-2FSGA2577I has significantly transformed the landscape of several sectors, enhancing industry standards and pushing the boundaries of technological advancement.

Application Scenario:

In the aerospace industry, XCVU27P-2FSGA2577I plays a pivotal role in mission-critical systems, such as onboard flight control and navigation. Its high computational throughput and real-time processing capabilities enable the implementation of complex algorithms for flight trajectory optimization and autonomous operation.

Circuit Design:

To integrate XCVU27P-2FSGA2577I into an aerospace application, meticulous circuit design considerations are essential:

1. System Integration:

Interconnect XCVU27P-2FSGA2577I with various sensors and actuators essential for flight control, such as gyroscopes, accelerometers, and control surfaces. Utilize high-speed serial interfaces like PCIe or Ethernet for data communication between the FPGA and other avionics systems.

2. Redundancy and Fault Tolerance:

Implement redundancy and fault-tolerant mechanisms within the FPGA design to ensure the system's reliability and resilience against hardware failures or environmental disturbances. Employ techniques such as triple modular redundancy (TMR) and error-correcting codes (ECC) for critical components.

3. Real-Time Data Processing:

Utilize the parallel processing capabilities of XCVU27P-2FSGA2577I to perform real-time data processing tasks, such as sensor fusion and trajectory prediction. Optimize algorithms for efficient resource utilization and low-latency response, crucial for time-sensitive applications like flight control.

4. Power Efficiency:

Optimize the FPGA design for power efficiency to meet the stringent power constraints of aerospace applications. Employ clock gating, power gating, and dynamic voltage and frequency scaling techniques to minimize power consumption without compromising performance.

5. Compliance and Certification:

Ensure that the FPGA design complies with industry regulations and safety standards, such as DO-254 for airborne electronic hardware and DO-178C for software considerations. Conduct thorough verification and validation tests to obtain certification from aviation authorities.

Considerations:

When deploying XCVU27P-2FSGA2577I in aerospace applications, several critical considerations must be addressed:

- Radiation Hardening: Implement radiation-hardened design techniques to mitigate the effects of cosmic rays and ionizing radiation in high-altitude and space environments.

- Thermal Management: Ensure effective thermal management solutions to dissipate heat generated by the FPGA and prevent overheating, which can degrade performance and reliability.

- Environmental Resilience: Design the system to withstand extreme environmental conditions, including temperature variations, humidity, vibration, and electromagnetic interference (EMI), encountered during flight operations.

- System Safety: Implement safety-critical features and fail-safe mechanisms to prevent catastrophic failures and ensure the safety of onboard personnel and assets.

- Lifecycle Support: Provide long-term lifecycle support for the FPGA-based systems, including availability of spare parts, software updates, and obsolescence management, to sustain operational capability throughout the aircraft's lifespan.

XCVU27P-2FSGA2577I FAQ

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3. Are the XCVU27P-2FSGA2577I price and inventory displayed accurate?

The price and inventory of XCVU27P-2FSGA2577I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU27P-2FSGA2577I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU27P-2FSGA2577I we delivered, we will accept the replacement or return of the XCVU27P-2FSGA2577I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU27P-2FSGA2577I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations