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Name: XCVU23P-1VSVA1365I
Brand: AMD Xilinx
SKU: XCVU23P-1VSVA1365I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU23P-1VSVA1365I

Part No.:: XCVU23P-1VSVA1365I

Manufacturer:: AMD Xilinx

Package:: 1365-BFBGA, FCBGA

Datasheet:: XCVU23P-1VSVA1365I.pdf

Description:: IC FPGA VIRTEX-UP 1365FCBGA

In Stock:: 2305

Quantity:: Add To Cart

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XCVU23P-1VSVA1365I Specifications

Package/Case:
1365-BFBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
128700
NumberofLogicElements/Cells:
2252250
TotalRAMBits:
77909197
NumberofI/O:
364
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCVU23P-1VSVA1365I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU23P-1VSVA1365I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU23P-1VSVA1365I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU23P-1VSVA1365I information

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The application and technological advancement of XCVU23P-1VSVA1365I in specific industries

XCVU23P-1VSVA1365I is a highly advanced field-programmable gate array (FPGA) tailored for specific applications, offering unprecedented levels of performance and flexibility. Its integration of advanced features makes it ideal for revolutionizing various industries, including aerospace, telecommunications, automotive, and medical devices.

Application Scenario:

In the aerospace industry, XCVU23P-1VSVA1365I plays a pivotal role in enhancing the performance and functionality of onboard systems in spacecraft and satellites. Its high processing capability and reconfigurability enable complex tasks such as image processing, data compression, and communication protocol handling.

Circuit Design:

To harness the power of XCVU23P-1VSVA1365I in aerospace applications, the circuit design must focus on:

1. Sensor Integration:

Integrate various sensors for environmental monitoring, attitude determination, and payload sensing, ensuring compatibility with XCVU23P-1VSVA1365I's interfaces and processing capabilities.

2. Real-Time Processing:

Develop FPGA algorithms for real-time data processing, including sensor fusion, navigation computations, and fault detection, leveraging the parallel processing capabilities of XCVU23P-1VSVA1365I.

3. Communication Systems:

Implement high-speed communication interfaces, such as SpaceWire or Ethernet, to facilitate data exchange between XCVU23P-1VSVA1365I and other onboard systems, ground stations, or neighboring satellites.

4. Power Management:

Design efficient power management circuits to ensure XCVU23P-1VSVA1365I and associated subsystems operate reliably within the constraints of spacecraft power budgets and thermal environments.

5. Radiation Hardening:

Implement radiation-hardening techniques, such as triple modular redundancy (TMR) or scrubbing mechanisms, to mitigate the effects of radiation-induced errors on XCVU23P-1VSVA1365I's performance and reliability in space environments.

Considerations:

When designing circuits with XCVU23P-1VSVA1365I for aerospace applications, key considerations include:

- Reliability: Ensure the system can withstand the harsh conditions of space, including temperature extremes, vacuum, and radiation exposure.

- Redundancy: Incorporate redundancy mechanisms to mitigate the risk of single points of failure and enhance overall system reliability.

- Testing and Validation: Conduct rigorous testing and validation procedures, including simulation, environmental testing, and in-orbit validation, to verify the performance and reliability of the system.

- Compliance: Ensure compliance with relevant industry standards and regulations, such as NASA's Space Plug-and-Play Avionics (SPA) standard or European Cooperation for Space Standardization (ECSS) requirements.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades or enhancements, allowing for the integration of new sensors, communication protocols, or processing algorithms as mission requirements evolve.

XCVU23P-1VSVA1365I FAQ

1. How to order XCVU23P-1VSVA1365I on icwhale.com?

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We have a professional and experienced quality control team to strictly verify and test the XCVU23P-1VSVA1365I. All suppliers must pass our qualification reviews before they can publish their products including XCVU23P-1VSVA1365I on icwhale.com; we pay more attention to the channels and quality of XCVU23P-1VSVA1365I products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XCVU23P-1VSVA1365I price and inventory displayed accurate?

The price and inventory of XCVU23P-1VSVA1365I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU23P-1VSVA1365I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU23P-1VSVA1365I we delivered, we will accept the replacement or return of the XCVU23P-1VSVA1365I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU23P-1VSVA1365I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations