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Name: XCVU190-3FLGB2104E
Brand: AMD Xilinx
SKU: XCVU190-3FLGB2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU190-3FLGB2104E

Part No.:: XCVU190-3FLGB2104E

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU190-3FLGB2104E.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

In Stock:: 2765

Quantity:: Add To Cart

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XCVU190-3FLGB2104E Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale™
ProductStatus:
Active
NumberofLABs/CLBs:
134280
NumberofLogicElements/Cells:
2349900
TotalRAMBits:
150937600
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.970V ~ 1.030V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU190-3FLGB2104E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU190-3FLGB2104E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU190-3FLGB2104E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU190-3FLGB2104E information

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The application and technological advancement of XCVU190-3FLGB2104E in specific industries

XCVU190-3FLGB2104E is a powerful FPGA (Field-Programmable Gate Array) chip designed by Xilinx, offering high performance and flexibility for a wide range of applications. It features advanced processing capabilities, massive parallelism, and extensive I/O resources, making it suitable for demanding tasks in various industries.

Application Scenario:

In the aerospace industry, XCVU190-3FLGB2104E plays a crucial role in onboard systems for spacecraft and satellites. Its ability to handle complex algorithms, high-speed data processing, and real-time communication makes it ideal for navigation, control, and payload processing applications.

Circuit Design:

To integrate XCVU190-3FLGB2104E into aerospace systems, designers must consider the following aspects:

1. Parallel Processing:

Utilize the massive parallel processing capabilities of XCVU190-3FLGB2104E to implement computationally intensive algorithms for tasks such as image processing, signal filtering, and sensor fusion.

2. Real-Time Communication:

Implement high-speed serial communication interfaces, such as PCIe or Ethernet, to facilitate data exchange between XCVU190-3FLGB2104E and other onboard systems or ground stations. Utilize the FPGA's built-in transceivers for reliable data transmission.

3. Fault Tolerance:

Design redundancy and fault-tolerant mechanisms within the FPGA architecture to ensure system reliability in harsh aerospace environments, where radiation and temperature fluctuations can pose challenges.

4. Power Efficiency:

Optimize power consumption by implementing dynamic power management techniques and clock gating strategies, leveraging the reconfigurability of XCVU190-3FLGB2104E to adapt to varying processing loads.

5. Integration with Sensors:

Integrate sensor interfaces, such as ADCs (Analog-to-Digital Converters) and sensor fusion algorithms, to enable precise navigation, attitude control, and environmental monitoring functionalities.

Considerations:

When designing FPGA-based systems for aerospace applications, it's essential to address the following considerations:

- Radiation Hardening: Implement radiation-hardened designs and mitigation techniques to safeguard XCVU190-3FLGB2104E against single-event upsets (SEUs) and total ionizing dose (TID) effects.

- Environmental Testing: Subject the system to rigorous environmental testing, including thermal vacuum chambers and vibration tests, to validate performance and reliability under simulated space conditions.

- Configuration Management: Establish robust configuration management procedures to ensure the integrity and security of FPGA bitstreams throughout the lifecycle of the aerospace systems.

- Compliance Standards: Adhere to industry-specific standards and regulations, such as DO-254 for airborne electronic hardware and ECSS-Q-ST-60-15C for space systems, to achieve certification and regulatory compliance.

- System Integration: Collaborate closely with system integrators and OEMs (Original Equipment Manufacturers) to seamlessly integrate XCVU190-3FLGB2104E into broader spacecraft and satellite architectures, ensuring interoperability and compatibility.

XCVU190-3FLGB2104E FAQ

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3. Are the XCVU190-3FLGB2104E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU190-3FLGB2104E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU190-3FLGB2104E we delivered, we will accept the replacement or return of the XCVU190-3FLGB2104E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU190-3FLGB2104E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations