XCVU190-2FLGA2577I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU190-2FLGA2577I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU190-2FLGA2577I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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Application Scenario:
In the aerospace industry, XCVU190-2FLGA2577I finds extensive use in onboard processing systems for satellite communication and remote sensing applications.
Circuit Design:
To design an onboard processing system using XCVU190-2FLGA2577I, follow these steps:
1. Sensor Interface:
Connect various sensors, such as cameras, spectrometers, or radar modules, to the FPGA's high-speed transceiver ports for data acquisition. Utilize protocols like MIPI CSI-2 or LVDS for interfacing with imaging sensors.
2. Data Processing:
Implement custom algorithms and signal processing pipelines within the FPGA fabric to process incoming sensor data in real-time. Utilize the FPGA's parallel processing capabilities for efficient computation.
3. Communication:
Integrate communication interfaces like Ethernet or SpaceWire to facilitate data exchange with other onboard systems or ground stations. Utilize high-speed serial transceivers of XCVU190-2FLGA2577I for reliable data transmission.
4. Fault Tolerance:
Implement redundancy and error correction mechanisms within the FPGA design to ensure system reliability in harsh space environments where radiation-induced errors are prevalent.
5. Power Management:
Design power supply and management circuitry to provide stable voltage and current levels to XCVU190-2FLGA2577I and associated peripherals. Implement power-saving techniques to optimize energy consumption.
Considerations:
When designing the system, consider:
- Radiation Hardening: Employ radiation-hardened components and design techniques to mitigate the effects of cosmic radiation on FPGA operation.
- Thermal Management: Implement thermal management solutions to dissipate heat generated during high-speed data processing and ensure proper functioning of the FPGA in extreme temperature conditions.
- Compliance: Ensure compliance with industry standards and regulations for satellite communication systems, such as CCSDS protocols and ECSS standards, to facilitate interoperability and reliability.
- Testing and Validation: Conduct extensive testing and validation of the onboard processing system to verify performance, reliability, and compliance with mission requirements before deployment.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU190-2FLGA2577I we delivered, we will accept the replacement or return of the XCVU190-2FLGA2577I only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XCVU190-2FLGA2577I.
(3)The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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