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Name: XCVU13P-2FSGA2577E
Brand: AMD Xilinx
SKU: XCVU13P-2FSGA2577E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCVU13P-2FSGA2577E

Part No.:: XCVU13P-2FSGA2577E

Manufacturer:: AMD Xilinx

Package:: 2577-BBGA, FCBGA

Datasheet:: XCVU13P-2FSGA2577E.pdf

Description:: IC FPGA 448 I/O 2577FCBGA

In Stock:: 3487

Quantity:: Add To Cart

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XCVU13P-2FSGA2577E Specifications

Package/Case:
2577-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
216000
NumberofLogicElements/Cells:
3780000
TotalRAMBits:
99090432
NumberofI/O:
448
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU13P-2FSGA2577E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU13P-2FSGA2577E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU13P-2FSGA2577E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU13P-2FSGA2577E information

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The application and technological advancement of XCVU13P-2FSGA2577E in specific industries

XCVU13P-2FSGA2577E is a powerful field-programmable gate array (FPGA) designed by Xilinx, offering high performance and versatility for a wide range of applications in industries such as aerospace, telecommunications, automotive, and medical devices.

Application Scenario:

In the aerospace industry, XCVU13P-2FSGA2577E plays a crucial role in implementing advanced signal processing algorithms for radar systems, satellite communication, and onboard navigation systems.

Circuit Design:

To harness the capabilities of XCVU13P-2FSGA2577E in aerospace applications, consider the following design aspects:

1. Signal Processing:

Utilize the high-speed processing capabilities of XCVU13P-2FSGA2577E to implement complex algorithms for radar signal processing, including pulse compression, target detection, and tracking.

2. Communication Interfaces:

Integrate various communication interfaces, such as high-speed serial transceivers (e.g., PCIe, SATA) and Ethernet controllers, to enable data exchange between the FPGA-based processing system and other onboard avionics components.

3. Fault Tolerance:

Implement redundant processing paths and fault detection mechanisms using built-in self-test (BIST) features of XCVU13P-2FSGA2577E to ensure system reliability and resilience against single-point failures.

4. Power Management:

Design efficient power supply and management circuits to provide stable voltage levels to the FPGA and associated peripherals, considering the stringent power constraints and thermal management requirements of aerospace platforms.

5. Radiation Hardening:

Optimize the FPGA design and packaging for radiation tolerance to mitigate the effects of ionizing radiation encountered in space environments, ensuring reliable operation throughout the mission lifespan.

Considerations:

When deploying XCVU13P-2FSGA2577E in aerospace systems, it's essential to address the following considerations:

- Performance Optimization: Utilize FPGA synthesis and optimization tools to maximize resource utilization and achieve the desired performance metrics for signal processing and communication tasks.

- Compliance Standards: Ensure compliance with industry-specific standards, such as DO-254 for airborne electronic hardware and RTCA/DO-178 for software considerations, to meet regulatory requirements and ensure airworthiness certification.

- Environmental Conditions: Validate the FPGA design and system integration under extreme temperature, vibration, and electromagnetic interference (EMI) conditions typical of aerospace operating environments.

- System Integration: Collaborate closely with system integrators and OEMs to seamlessly integrate the FPGA-based processing subsystem into the overall avionics architecture, considering factors such as data bus compatibility and interface interoperability.

- Lifecycle Management: Plan for long-term support and maintenance of the FPGA-based systems, including FPGA device obsolescence management and provision for future technology upgrades to extend the operational lifespan of aerospace platforms.

XCVU13P-2FSGA2577E FAQ

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3. Are the XCVU13P-2FSGA2577E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU13P-2FSGA2577E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU13P-2FSGA2577E we delivered, we will accept the replacement or return of the XCVU13P-2FSGA2577E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU13P-2FSGA2577E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations