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Name: XCVU13P-2FHGB2104I
Brand: Xilinx Inc.
SKU: XCVU13P-2FHGB2104I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Xilinx Inc. XCVU13P-2FHGB2104I

Part No.:: XCVU13P-2FHGB2104I

Manufacturer:: Xilinx Inc.

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU13P-2FHGB2104I.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

In Stock:: 3185

Quantity:: Add To Cart

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XCVU13P-2FHGB2104I Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
216000
NumberofLogicElements/Cells:
3780000
TotalRAMBits:
514867200
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCVU13P-2FHGB2104I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU13P-2FHGB2104I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU13P-2FHGB2104I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU13P-2FHGB2104I information

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XCVU13P-2FHGB2104I Typical application Circuitry

The XCVU13P-2FHGB2104I is a part of Xilinx's UltraScale+ FPGA family, known for its advanced features, high performance, and enhanced programmability.

Applications of XCVU13P-2FHGB2104I:

- Data Center Acceleration

- Wired communication

- Cryptography & secure communication

- High-performance computing

- Video & image processing

- AI and machine learning acceleration

Key Features of XCVU13P-2FHGB2104I:

1. Crafted using a cutting-edge process technology.

2. Houses an impressive number of logic cells.

3. Accommodates high-speed transceivers and enhanced memory interface support.

4. Integrated with DSP slices for mathematical and signal processing.

5. Furnished with security features to thwart tampering and counterfeiting.

6. Provides PCIe Gen4 support for faster data transfers.

Considering an application in Data Center Acceleration, let's delve deeper into how the XCVU13P-2FHGB2104I can be incorporated.

1. Power Supplies:

Given the diverse capabilities of the XCVU13P-2FHGB2104I, multiple power supplies are necessitated. Such as:

- VCCINT for internal logic

- VCCBRAM for block RAMs

- VCCAUX for auxiliary circuits

Each power supply requires a decoupling capacitor network for stability.

2. JTAG Interface for Debugging:

The JTAG interface facilitates chip configuration and troubleshooting. For the XCVU13P-2FHGB2104I:

- TDI (Test Data In): Pin X.

- TDO (Test Data Out): Pin Y.

- TCK (Test Clock): Pin Z.

- TMS (Test Mode Select): Pin W.

(Note: Pin X, Y, Z, W are illustrative, and the exact pin numbers should be referred from the official datasheet.)

3. Clock Management:

A stable clock source, such as an external crystal oscillator, should be connected to dedicated clock input pins.

4. I/O Configuration:

Depending on your acceleration application, I/O pins can be tailored to interface with memory modules, processors, or other peripheral devices. Proper termination is crucial to ensure signal integrity.

5. Transceivers:

The XCVU13P-2FHGB2104I incorporates high-speed transceivers. When setting them up, attention to impedance matching, trace length matching, and clean power supply is vital.

When designing with the XCVU13P-2FHGB2104I, contemplate the following:

1. Signal Integrity: Pivotal for high-speed interfaces.

2. Thermal Management: Effective heat dissipation strategies, possibly using heat sinks or fans, can prolong the chip's life.

3. Power Integrity: A stable, noise-free power source is non-negotiable.

4. PCB Layout: An optimized layout that considers trace lengths, interference, and space constraints is imperative.

In essence, XCVU13P-2FHGB2104I offers unmatched capabilities, especially for applications like Data Center Acceleration. Proper design considerations can harness its full potential.

XCVU13P-2FHGB2104I FAQ

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3. Are the XCVU13P-2FHGB2104I price and inventory displayed accurate?

The price and inventory of XCVU13P-2FHGB2104I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU13P-2FHGB2104I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU13P-2FHGB2104I we delivered, we will accept the replacement or return of the XCVU13P-2FHGB2104I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU13P-2FHGB2104I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations