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Name: XCVU125-2FLVB1760I
Brand: AMD Xilinx
SKU: XCVU125-2FLVB1760I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU125-2FLVB1760I

Part No.:: XCVU125-2FLVB1760I

Manufacturer:: AMD Xilinx

Package:: 1760-BBGA, FCBGA

Datasheet:: XCVU125-2FLVB1760I.pdf

Description:: IC FPGA 702 I/O 1760FCBGA

In Stock:: 3302

Quantity:: Add To Cart

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XCVU125-2FLVB1760I Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Bulk
Series:
Virtex® UltraScale™
ProductStatus:
Active
NumberofLABs/CLBs:
89520
NumberofLogicElements/Cells:
1566600
TotalRAMBits:
90726400
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.922V ~ 0.979V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XCVU125-2FLVB1760I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU125-2FLVB1760I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU125-2FLVB1760I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU125-2FLVB1760I information

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The application and technological advancement of XCVU125-2FLVB1760I in specific industries

XCVU125-2FLVB1760I is a high-performance field-programmable gate array (FPGA) chip designed by Xilinx, offering extensive capabilities for demanding applications in various industries. With its advanced architecture and large capacity, the XCVU125-2FLVB1760I FPGA enables innovative solutions and enhances technological standards across multiple sectors.

Application Scenario:

In the aerospace industry, XCVU125-2FLVB1760I plays a crucial role in avionics systems, satellite communications, and onboard processing. Its exceptional processing power and flexibility make it ideal for implementing complex algorithms, signal processing tasks, and real-time data analysis in space missions and aircraft operations.

Circuit Design:

To integrate XCVU125-2FLVB1760I into aerospace applications, consider the following design aspects:

1. Signal Processing:

Utilize the FPGA's high-speed serial transceivers and parallel processing capabilities to handle data from various sensors, communication interfaces, and control systems onboard spacecraft or aircraft. Implement algorithms for signal filtering, modulation/demodulation, and error correction to ensure reliable data transmission and reception.

2. Mission Control:

Develop custom firmware and software for mission-critical functions, such as attitude control, trajectory calculations, and payload operations. Use the FPGA's reconfigurability to adapt to evolving mission requirements and optimize performance in real-time.

3. Communication Systems:

Integrate XCVU125-2FLVB1760I into satellite communication systems for signal processing, modulation, and encryption tasks. Implement protocols like DVB-S2X, CCSDS, or custom communication standards to ensure high-speed data transfer and robust link performance in spaceborne and terrestrial networks.

4. Sensor Fusion:

Combine data from multiple sensors, including inertial measurement units (IMUs), GPS receivers, and environmental sensors, using the FPGA's parallel processing capabilities. Implement sensor fusion algorithms to provide accurate navigation, attitude estimation, and environmental monitoring for spacecraft and unmanned aerial vehicles (UAVs).

5. Radiation Hardening:

Design radiation-tolerant and fault-tolerant circuits using built-in features of XCVU125-2FLVB1760I to withstand the harsh space environment. Implement triple modular redundancy (TMR), error correction codes (ECC), and scrubbing techniques to mitigate the effects of radiation-induced single-event upsets (SEUs) and ensure system reliability.

Considerations:

When designing FPGA-based systems for aerospace applications, it's essential to address the following considerations:

- Reliability and Redundancy: Implement redundant components and fault-tolerant architectures to ensure system reliability and resilience against hardware failures.

- Power and Thermal Management: Optimize power consumption and heat dissipation to meet strict energy and thermal constraints in spaceborne and airborne platforms.

- Compliance and Certification: Adhere to industry standards and regulatory requirements, such as DO-254 for airborne electronic hardware and MIL-STD-883 for spaceborne components, to ensure compliance and certification of FPGA-based systems for aerospace use.

- Testing and Verification: Conduct thorough testing and verification procedures, including simulation, emulation, and in-circuit testing, to validate the functionality, performance, and safety of FPGA-based systems in aerospace environments.

- Future Scalability: Design FPGA architectures with scalability and flexibility to accommodate future upgrades, enhancements, and technology advancements in aerospace missions and applications.

XCVU125-2FLVB1760I FAQ

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3. Are the XCVU125-2FLVB1760I price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU125-2FLVB1760I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU125-2FLVB1760I we delivered, we will accept the replacement or return of the XCVU125-2FLVB1760I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU125-2FLVB1760I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

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