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Name: XCVU11P-L2FLGB2104E
Brand: AMD Xilinx
SKU: XCVU11P-L2FLGB2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU11P-L2FLGB2104E

Part No.:: XCVU11P-L2FLGB2104E

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU11P-L2FLGB2104E.pdf

Description:: IC FPGA 572 I/O 2104FCBGA

In Stock:: 3410

Quantity:: Add To Cart

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XCVU11P-L2FLGB2104E Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
162000
NumberofLogicElements/Cells:
2835000
TotalRAMBits:
396150400
NumberofI/O:
572
NumberofGates:
-
Voltage-Supply:
0.698V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU11P-L2FLGB2104E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU11P-L2FLGB2104E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU11P-L2FLGB2104E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU11P-L2FLGB2104E information

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The application and technological advancement of XCVU11P-L2FLGB2104E in specific industries

XCVU11P-L2FLGB2104E is a high-performance field-programmable gate array (FPGA) chip designed by Xilinx, tailored for specific applications demanding advanced processing capabilities and high-speed data processing.

Application Scenario:

In the aerospace industry, XCVU11P-L2FLGB2104E plays a pivotal role in mission-critical systems such as radar signal processing and satellite communication. Its unparalleled processing power and reconfigurability make it ideal for handling complex algorithms and real-time data streams in satellite navigation, communication, and imaging systems.

Circuit Design:

To harness the capabilities of XCVU11P-L2FLGB2104E in aerospace applications, engineers must meticulously design the FPGA-based systems with the following considerations:

1. High-Speed Data Interfaces:

Utilize high-speed serial transceivers and interfaces such as PCIe, Gigabit Ethernet, and SERDES to facilitate fast data transfer between the FPGA chip and external components like sensors, communication modules, and memory devices.

2. Real-Time Signal Processing:

Implement efficient signal processing algorithms in the FPGA fabric to handle tasks such as radar signal filtering, Doppler processing, and digital beamforming in real-time. Leveraging the parallel processing capabilities of the FPGA, these algorithms can significantly enhance the performance and accuracy of aerospace systems.

3. Fault Tolerance and Reliability:

Design redundancy and fault-tolerant mechanisms within the FPGA-based systems to ensure reliable operation in harsh aerospace environments where system failure is not an option. Employ techniques such as Triple Modular Redundancy (TMR) and Error Correction Codes (ECC) to detect and correct errors in critical data paths.

4. Low-Power Design:

Optimize the FPGA design for low power consumption to meet the stringent power constraints of aerospace platforms, especially in battery-operated or energy-harvesting systems. Employ power gating, clock gating, and dynamic voltage and frequency scaling techniques to minimize power consumption during idle or low-utilization periods.

5. Compliance with Industry Standards:

Ensure that the FPGA-based systems comply with industry standards and regulations for aerospace applications, including DO-254 for design assurance, DO-178C for software considerations, and MIL-STD-810 for environmental testing. Conduct thorough verification and validation testing to certify the systems for use in mission-critical aerospace missions.

Impact on Industry:

The integration of XCVU11P-L2FLGB2104E FPGA chips in aerospace applications has revolutionized the industry by:

- Enhancing System Performance: By enabling real-time signal processing and high-speed data handling, FPGA-based systems powered by XCVU11P-L2FLGB2104E have significantly improved the performance and reliability of aerospace platforms, leading to safer and more efficient operations.

- Reducing Development Time: The reconfigurability and flexibility of FPGA technology have streamlined the development process for aerospace systems, allowing engineers to quickly adapt to changing requirements and implement custom functionalities without the need for hardware redesign.

- Advancing Mission Capabilities: The advanced processing capabilities of XCVU11P-L2FLGB2104E FPGA chips have enabled the implementation of complex algorithms and advanced features in aerospace missions, such as autonomous navigation, adaptive communication protocols, and real-time image processing, expanding the scope and capabilities of space exploration and satellite missions.

Conclusion:

In conclusion, XCVU11P-L2FLGB2104E FPGA chips have emerged as indispensable components in aerospace applications, empowering engineers to design innovative and high-performance systems for mission-critical tasks. With their unmatched processing power, flexibility, and reliability, these FPGA chips are driving advancements in aerospace technology and shaping the future of space exploration and satellite communication.

XCVU11P-L2FLGB2104E FAQ

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6. What is the process for return or replacement of XCVU11P-L2FLGB2104E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU11P-L2FLGB2104E we delivered, we will accept the replacement or return of the XCVU11P-L2FLGB2104E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU11P-L2FLGB2104E.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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