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Name: XCVU11P-3FLGF1924E
Brand: AMD Xilinx
SKU: XCVU11P-3FLGF1924E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU11P-3FLGF1924E

Part No.:: XCVU11P-3FLGF1924E

Manufacturer:: AMD Xilinx

Package:: 1924-BBGA, FCBGA

Datasheet:: XCVU11P-3FLGF1924E.pdf

Description:: IC FPGA 624 I/O 1924FCBGA

In Stock:: 2124

Quantity:: Add To Cart

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XCVU11P-3FLGF1924E Specifications

Package/Case:
1924-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
162000
NumberofLogicElements/Cells:
2835000
TotalRAMBits:
396150400
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.873V ~ 0.927V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU11P-3FLGF1924E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU11P-3FLGF1924E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU11P-3FLGF1924E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU11P-3FLGF1924E information

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The application and technological advancement of XCVU11P-3FLGF1924E in specific industries

XCVU11P-3FLGF1924E is a high-performance field-programmable gate array (FPGA) chip designed by Xilinx, offering exceptional processing power and flexibility for demanding applications. It features a large number of logic cells, DSP slices, and high-speed transceivers, making it ideal for a wide range of industries.

Application Scenario:

In the aerospace and defense industry, XCVU11P-3FLGF1924E plays a crucial role in radar systems, electronic warfare equipment, and communication systems. Its ability to handle complex algorithms and real-time data processing makes it indispensable for mission-critical applications.

Circuit Design:

To implement XCVU11P-3FLGF1924E in aerospace and defense systems, consider the following design aspects:

1. Signal Processing:

Utilize the DSP slices available in XCVU11P-3FLGF1924E to implement advanced signal processing algorithms for radar signal analysis, target tracking, and jamming mitigation.

2. Data Interface:

Integrate high-speed transceivers of XCVU11P-3FLGF1924E to interface with external sensors, communication modules, and data storage devices. These transceivers enable high-bandwidth data transfer, essential for real-time information exchange in aerospace and defense applications.

3. Redundancy and Fault Tolerance:

Implement redundancy and fault-tolerant mechanisms in the FPGA design to ensure system reliability and resilience against hardware failures or environmental hazards. This is critical for maintaining operational continuity in mission-critical scenarios.

4. Encryption and Security:

Utilize the security features of XCVU11P-3FLGF1924E to implement encryption algorithms and secure communication protocols, safeguarding sensitive data transmitted within the aerospace and defense systems from unauthorized access or tampering.

5. System Integration:

Ensure seamless integration of XCVU11P-3FLGF1924E into the overall system architecture, considering factors such as power supply, thermal management, and compatibility with other components. Collaborate closely with system engineers to optimize system performance and reliability.

Considerations:

When designing with XCVU11P-3FLGF1924E, it's essential to address the following considerations specific to aerospace and defense applications:

- Radiation Hardening: Implement radiation-hardened design techniques to mitigate the effects of cosmic rays and electromagnetic interference, ensuring the reliability of FPGA operation in space or high-altitude environments.

- Compliance with MIL-STD: Ensure compliance with military standards (MIL-STD) for electronic components and systems, including requirements for environmental testing, reliability, and electromagnetic compatibility (EMC).

- Scalability and Upgradability: Design the FPGA-based systems with scalability and upgradability in mind, allowing for future enhancements and integration of new capabilities to adapt to evolving mission requirements and technology advancements.

- Lifecycle Management: Plan for long-term lifecycle management of XCVU11P-3FLGF1924E and associated components, considering obsolescence management, spare parts availability, and technology refresh cycles to ensure sustained operational readiness of aerospace and defense systems.

XCVU11P-3FLGF1924E FAQ

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3. Are the XCVU11P-3FLGF1924E price and inventory displayed accurate?

The price and inventory of XCVU11P-3FLGF1924E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCVU11P-3FLGF1924E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU11P-3FLGF1924E we delivered, we will accept the replacement or return of the XCVU11P-3FLGF1924E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU11P-3FLGF1924E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations