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Name: XCVU11P-3FLGC2104E
Brand: AMD Xilinx
SKU: XCVU11P-3FLGC2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU11P-3FLGC2104E

Part No.:: XCVU11P-3FLGC2104E

Manufacturer:: AMD Xilinx

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU11P-3FLGC2104E.pdf

Description:: IC FPGA 416 I/O 2104FCBGA

In Stock:: 2403

Quantity:: Add To Cart

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XCVU11P-3FLGC2104E Specifications

Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
162000
NumberofLogicElements/Cells:
2835000
TotalRAMBits:
396150400
NumberofI/O:
416
NumberofGates:
-
Voltage-Supply:
0.873V ~ 0.927V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU11P-3FLGC2104E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU11P-3FLGC2104E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU11P-3FLGC2104E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU11P-3FLGC2104E information

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The application and technological advancement of XCVU11P-3FLGC2104E in specific industries

XCVU11P-3FLGC2104E is a high-performance FPGA chip designed by Xilinx, known for its extensive capabilities and versatility in various applications. With its advanced architecture and features, it has found significant utilization in several industries, revolutionizing standards and enhancing technological capabilities.

Application Scenario:

In the aerospace industry, XCVU11P-3FLGC2104E plays a crucial role in mission-critical systems such as satellite communication, onboard processing, and radar signal processing. Its high-speed processing capability and reconfigurability make it ideal for handling complex algorithms and data processing tasks in space missions.

Circuit Design:

To integrate XCVU11P-3FLGC2104E into an aerospace system, the following steps are essential:

1. System Architecture:

Define the overall system architecture considering the specific requirements of the mission, including data throughput, processing latency, and power constraints. Determine the optimal configuration of the FPGA fabric and peripherals to meet these requirements.

2. Signal Processing:

Implement signal processing algorithms, such as digital signal modulation/demodulation, error correction coding, and beamforming, using the FPGA's parallel processing capability. Utilize the high-speed transceivers and DSP slices available in XCVU11P-3FLGC2104E for efficient data processing.

3. Communication Interfaces:

Interface XCVU11P-3FLGC2104E with external communication modules such as RF transceivers, Ethernet controllers, and serial interfaces for data exchange with ground stations or other satellites. Configure the FPGA's I/O banks and transceivers to meet the communication protocol requirements.

4. Redundancy and Fault Tolerance:

Implement redundancy and fault-tolerant mechanisms within the FPGA design to ensure the reliability of critical functions. Utilize built-in features such as partial reconfiguration and error correction codes to mitigate the impact of radiation-induced errors or hardware faults.

5. Power Management:

Optimize power consumption by dynamically adjusting the operating voltage and clock frequency of XCVU11P-3FLGC2104E based on the workload and environmental conditions. Implement power gating techniques to disable unused resources and reduce static power consumption during idle periods.

Considerations:

When designing FPGA-based systems for aerospace applications, several considerations are essential:

- Radiation Hardening: Ensure that the FPGA design and packaging are radiation hardened to withstand the harsh space environment and mitigate single-event effects.

- Thermal Management: Implement efficient thermal management solutions to dissipate the heat generated by XCVU11P-3FLGC2104E and prevent overheating, which can degrade performance and reliability.

- Compliance and Certification: Verify compliance with industry standards and obtain necessary certifications, such as DO-254 for airborne electronic hardware, to ensure the safety and reliability of the FPGA-based systems.

- System Integration: Integrate the FPGA-based subsystem seamlessly with other onboard systems, such as attitude control, navigation, and payload instruments, to achieve overall mission objectives effectively.

- Testing and Validation: Conduct extensive testing and validation of the FPGA design using simulation tools, hardware-in-the-loop testing, and on-orbit testing to verify functionality and performance under nominal and off-nominal conditions.

XCVU11P-3FLGC2104E FAQ

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3. Are the XCVU11P-3FLGC2104E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU11P-3FLGC2104E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU11P-3FLGC2104E we delivered, we will accept the replacement or return of the XCVU11P-3FLGC2104E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU11P-3FLGC2104E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations