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Name: XCVU095-3FFVB1760E
Brand: AMD Xilinx
SKU: XCVU095-3FFVB1760E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCVU095-3FFVB1760E

Part No.:: XCVU095-3FFVB1760E

Manufacturer:: AMD Xilinx

Package:: 1760-BBGA, FCBGA

Datasheet:: XCVU095-3FFVB1760E.pdf

Description:: IC FPGA 702 I/O 1760FCBGA

In Stock:: 2104

Quantity:: Add To Cart

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XCVU095-3FFVB1760E Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Bulk
Series:
Virtex® UltraScale™
ProductStatus:
Active
NumberofLABs/CLBs:
67200
NumberofLogicElements/Cells:
1176000
TotalRAMBits:
62259200
NumberofI/O:
702
NumberofGates:
-
Voltage-Supply:
0.970V ~ 1.030V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCVU095-3FFVB1760E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCVU095-3FFVB1760E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCVU095-3FFVB1760E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCVU095-3FFVB1760E information

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The application and technological advancement of XCVU095-3FFVB1760E in specific industries

XCVU095-3FFVB1760E is a highly advanced field-programmable gate array (FPGA) chip, renowned for its exceptional processing power and versatility. It has gained significant prominence in various industries due to its ability to revolutionize conventional approaches and elevate technological standards.

Application Scenario:

In the aerospace industry, XCVU095-3FFVB1760E plays a pivotal role in enhancing the performance and reliability of onboard systems in spacecraft and satellites. Its immense processing capabilities enable the implementation of complex algorithms for navigation, communication, and data processing, contributing to the advancement of space exploration missions.

Circuit Design:

To integrate XCVU095-3FFVB1760E into aerospace systems, meticulous circuit design is imperative:

1. Sensor Interface:

Connect various sensors, such as inertial measurement units (IMUs) and thermal sensors, to XCVU095-3FFVB1760E for precise environmental monitoring and navigation data acquisition. Utilize dedicated input/output pins of the FPGA for sensor interfacing and implement appropriate signal conditioning circuits for accurate sensor readings.

2. Communication:

Implement high-speed communication interfaces, including SpaceWire or MIL-STD-1553, to facilitate seamless data exchange between XCVU095-3FFVB1760E and other onboard systems or ground stations. Configure FPGA I/O pins for these interfaces and ensure compatibility with industry-standard protocols.

3. Signal Processing:

Utilize the immense processing power of XCVU095-3FFVB1760E to perform real-time signal processing tasks, such as image enhancement for remote sensing applications or digital signal modulation for communication purposes. Develop efficient FPGA algorithms to maximize processing throughput and minimize latency.

4. Redundancy and Fault Tolerance:

Implement redundancy schemes and fault-tolerant mechanisms within the FPGA design to enhance system reliability and mitigate the risks associated with radiation-induced errors in space environments. Employ built-in self-test (BIST) features and error-correction techniques to ensure continuous operation despite potential hardware faults.

5. Power Management:

Design efficient power management circuits to supply the required voltage levels to XCVU095-3FFVB1760E and associated peripherals while minimizing power consumption. Utilize voltage regulators, power converters, and energy harvesting techniques to optimize energy efficiency and extend mission duration.

Considerations:

When incorporating XCVU095-3FFVB1760E into aerospace systems, several considerations must be addressed:

- Radiation Hardening: Implement radiation-hardened design practices to mitigate the effects of ionizing radiation on FPGA functionality and ensure reliable operation in harsh space environments.

- Thermal Management: Develop effective thermal management strategies to dissipate heat generated by XCVU095-3FFVB1760E and prevent overheating, which could compromise system performance and longevity.

- Compliance and Certification: Ensure compliance with industry standards and regulatory requirements, such as DO-254 for airborne electronic hardware and ECSS-Q-ST-60C for space systems, to achieve certification for aerospace applications.

- Testing and Validation: Conduct comprehensive testing and validation procedures, including environmental testing (e.g., thermal vacuum testing, vibration testing) and functional verification, to verify the performance and reliability of XCVU095-3FFVB1760E in aerospace missions.

XCVU095-3FFVB1760E FAQ

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3. Are the XCVU095-3FFVB1760E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCVU095-3FFVB1760E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCVU095-3FFVB1760E we delivered, we will accept the replacement or return of the XCVU095-3FFVB1760E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVU095-3FFVB1760E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations