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Name: XCV300-4BG432C4307
Brand: AMD Xilinx
SKU: XCV300-4BG432C4307
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCV300-4BG432C4307

Part No.:: XCV300-4BG432C4307

Manufacturer:: AMD Xilinx

Package:: -

Datasheet:: XCV300-4BG432C4307.pdf

Description:: IC FPGA 316 I/O 432MBGA

In Stock:: 1448

Quantity:: Add To Cart

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XCV300-4BG432C4307 Specifications

Package/Case:
-
Packaging:
Bulk
Series:
*
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
-
TotalRAMBits:
-
NumberofI/O:
-
NumberofGates:
-
Voltage-Supply:
-
MountingType:
-
OperatingTemperature:
-

XCV300-4BG432C4307 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCV300-4BG432C4307 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCV300-4BG432C4307 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCV300-4BG432C4307 information

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XCV300-4BG432C4307 performance and reliability evaluation in extreme environments

XCV300-4BG432C4307 is a field-programmable gate array (FPGA) chip known for its robust performance and versatility in various applications, including aerospace, automotive, and industrial sectors. Its reliability in extreme environments is crucial for mission-critical tasks where consistent operation is paramount.

Environmental Considerations:

In the design of XCV300-4BG432C4307-based systems, several environmental factors are carefully considered to ensure reliable operation under extreme conditions:

- High Temperature: The FPGA's tolerance to high temperatures is crucial, especially in environments where heat dissipation is challenging. Thorough thermal analysis is conducted to ensure proper heat sinking and cooling mechanisms are in place to prevent overheating and maintain optimal performance.

- Low Temperature: Similarly, the FPGA's ability to function reliably at low temperatures is essential, particularly in aerospace and automotive applications where exposure to sub-zero temperatures is common. Cold start-up performance and component integrity under freezing conditions are thoroughly evaluated during testing.

- Humidity: Humidity can adversely affect electronic components, leading to corrosion and malfunction. Therefore, the XCV300-4BG432C4307 chip and its surrounding circuitry are designed with moisture-resistant materials and conformal coatings to mitigate the effects of humidity, ensuring long-term reliability in humid environments.

- Vibration and Shock: In rugged environments such as automotive and aerospace applications, the FPGA must withstand mechanical stresses caused by vibration and shock. Robust packaging and mounting techniques are employed to ensure the XCV300-4BG432C4307 chip remains securely in place and unaffected by external mechanical forces.

- Radiation: In space and nuclear applications, radiation can degrade semiconductor devices over time. Radiation-hardened versions of the XCV300-4BG432C4307 FPGA are available, featuring hardened designs and materials to withstand ionizing radiation and ensure reliable operation in radiation-rich environments.

Performance in Real-World Applications:

Despite the challenges posed by extreme environments, the XCV300-4BG432C4307 FPGA has demonstrated exceptional performance and reliability in various real-world applications:

- Aerospace: In satellite communication systems, the XCV300-4BG432C4307 FPGA is utilized for signal processing, data encryption, and control functions. Its ability to operate reliably in the harsh radiation environment of space makes it a preferred choice for spaceborne applications.

- Automotive: In automotive electronic control units (ECUs), the XCV300-4BG432C4307 FPGA is employed for real-time processing of sensor data, vehicle diagnostics, and advanced driver-assistance systems (ADAS). Its rugged construction and tolerance to temperature extremes ensure consistent performance in automotive environments.

- Industrial: In industrial automation and control systems, the XCV300-4BG432C4307 FPGA is used for high-speed data processing, motion control, and equipment monitoring. Its reliability in harsh industrial environments, including temperature fluctuations and electromagnetic interference, ensures uninterrupted operation of critical manufacturing processes.

Conclusion:

In conclusion, the XCV300-4BG432C4307 FPGA exhibits exceptional performance and reliability in extreme environments, thanks to careful consideration of environmental factors during the design phase and rigorous testing procedures. Its versatility and robustness make it a preferred choice for mission-critical applications where reliability is paramount.

XCV300-4BG432C4307 FAQ

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6. What is the process for return or replacement of XCV300-4BG432C4307?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCV300-4BG432C4307 we delivered, we will accept the replacement or return of the XCV300-4BG432C4307 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCV300-4BG432C4307.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations