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Name: XCR3512XL-7FG324C
Brand: AMD Xilinx
SKU: XCR3512XL-7FG324C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-7FG324C

Part No.:: XCR3512XL-7FG324C

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XCR3512XL-7FG324C.pdf

Description:: IC CPLD 512MC 7NSNS 324BGA

In Stock:: 3701

Quantity:: Add To Cart

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XCR3512XL-7FG324C Specifications

Package/Case:
324-BBGA
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
7 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
260
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3512XL-7FG324C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-7FG324C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-7FG324C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-7FG324C information

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Common technical challenges and solutions when using XCR3512XL-7FG324C

XCR3512XL-7FG324C is a field-programmable gate array (FPGA) device commonly used in digital logic design for a wide range of applications. It offers high logic density, flexible reconfiguration capabilities, and advanced features suitable for various embedded systems and signal processing tasks.

Technical Challenges:

When using XCR3512XL-7FG324C, several technical challenges may arise, including:

1. Noise Issues: FPGA designs often encounter noise problems due to high-speed switching signals and signal integrity issues, leading to timing violations and unreliable operation.

2. Power Consumption: FPGA devices like XCR3512XL-7FG324C can consume significant power, especially in complex designs or during high utilization, requiring efficient power management techniques to reduce overall power consumption.

3. Integration Complexity: Integrating XCR3512XL-7FG324C into a system involves complex design considerations, including interfacing with other components, optimizing resource utilization, and ensuring compatibility with existing hardware and software.

4. Timing Closure: Achieving timing closure in FPGA designs, especially with large and complex designs, can be challenging due to intricate routing constraints, signal propagation delays, and optimization trade-offs.

5. Configuration Management: Managing the configuration of XCR3512XL-7FG324C devices, including bitstream generation, storage, and deployment, requires careful attention to ensure correct functionality and reliability.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

1. Noise Mitigation: Employ proper PCB layout techniques, such as impedance matching, signal shielding, and ground plane optimization, to minimize noise and signal integrity issues.

2. Power Optimization: Utilize power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) techniques to reduce power consumption during idle or low-utilization periods while maintaining performance.

3. System-level Integration: Design modular and scalable architectures to simplify XCR3512XL-7FG324C integration, facilitate component reuse, and streamline system debugging and testing processes.

4. Timing Analysis and Optimization: Perform comprehensive timing analysis, utilize advanced synthesis and place-and-route optimizations, and iterate design iterations to meet timing requirements and achieve timing closure.

5. Configuration Management Tools: Implement robust configuration management tools and workflows, automate bitstream generation and deployment processes, and incorporate version control mechanisms to ensure configuration reliability and traceability.

Conclusion:

By addressing these technical challenges and implementing appropriate solutions and improvements, designers can effectively harness the capabilities of XCR3512XL-7FG324C FPGA devices in their applications, achieving reliable performance, efficient resource utilization, and seamless integration within complex embedded systems.

XCR3512XL-7FG324C FAQ

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3. Are the XCR3512XL-7FG324C price and inventory displayed accurate?

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6. What is the process for return or replacement of XCR3512XL-7FG324C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-7FG324C we delivered, we will accept the replacement or return of the XCR3512XL-7FG324C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-7FG324C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations