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Name: XCR3512XL-12FTG256I
Brand: AMD Xilinx
SKU: XCR3512XL-12FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-12FTG256I

Part No.:: XCR3512XL-12FTG256I

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3512XL-12FTG256I.pdf

Description:: IC CPLD 512MC 10.8NS 256BGA

In Stock:: 3806

Quantity:: Add To Cart

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XCR3512XL-12FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
212
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3512XL-12FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-12FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-12FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-12FTG256I information

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Common technical challenges and solutions when using XCR3512XL-12FTG256I

XCR3512XL-12FTG256I is a field-programmable gate array (FPGA) chip widely used in digital circuit design for its high performance and flexibility. However, several technical challenges may arise during its utilization, including noise issues, power consumption concerns, and complexity of integration.

Noise Mitigation:

To address noise problems in XCR3512XL-12FTG256I designs, employ proper signal integrity techniques such as impedance matching, routing guidelines, and grounding strategies. Utilize differential signaling and isolation techniques to minimize electromagnetic interference (EMI) and ensure reliable operation, especially in high-speed designs.

Power Optimization:

Optimizing power consumption in XCR3512XL-12FTG256I designs requires a multi-faceted approach. Implement power gating techniques to selectively disable unused portions of the FPGA, reducing static power consumption. Utilize advanced power management features available in the FPGA architecture, such as dynamic voltage and frequency scaling (DVFS) and clock gating, to dynamically adjust power levels based on workload requirements. Additionally, optimize logic synthesis and placement to minimize dynamic power consumption by reducing switching activity and maximizing resource utilization.

Integration Complexity:

Managing the complexity of integrating XCR3512XL-12FTG256I into larger systems involves careful planning and design methodologies. Utilize modular design techniques to break down the system into manageable blocks, each implemented within the FPGA. Employ standardized communication protocols, such as AXI or Wishbone, for inter-module communication to facilitate seamless integration and interoperability. Utilize hierarchical design methodologies to organize and structure the FPGA design hierarchy, simplifying design verification, debugging, and maintenance tasks.

Timing Closure:

Ensuring timing closure in XCR3512XL-12FTG256I designs is crucial for meeting performance requirements and avoiding timing violations. Utilize advanced synthesis and optimization techniques to optimize timing paths, such as pipelining, retiming, and resource duplication. Perform comprehensive static timing analysis (STA) and timing-driven placement and routing to identify and resolve timing violations early in the design process. Utilize constraint-driven design methodologies to specify timing requirements and constraints accurately, guiding the synthesis and optimization tools towards achieving timing closure.

Signal Integrity:

Ensuring signal integrity in XCR3512XL-12FTG256I designs is essential for reliable operation, especially in high-speed and high-frequency applications. Employ best practices in PCB layout and routing, such as controlled impedance traces, differential signaling, and signal termination techniques, to minimize signal degradation and reflections. Perform thorough signal integrity analysis, including simulation and modeling, to predict and mitigate signal integrity issues early in the design process. Utilize advanced FPGA features, such as built-in SERDES (Serializer/Deserializer) blocks and configurable I/O standards, to optimize signal integrity and interface with external devices effectively.

XCR3512XL-12FTG256I FAQ

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The price and inventory of XCR3512XL-12FTG256I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3512XL-12FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-12FTG256I we delivered, we will accept the replacement or return of the XCR3512XL-12FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-12FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations