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Name: XCR3512XL-12FTG256C
Brand: AMD Xilinx
SKU: XCR3512XL-12FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-12FTG256C

Part No.:: XCR3512XL-12FTG256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3512XL-12FTG256C.pdf

Description:: IC CPLD 512MC 10.8NS 256BGA

In Stock:: 3865

Quantity:: Add To Cart

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XCR3512XL-12FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3512XL-12FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-12FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-12FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-12FTG256C information

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Common technical challenges and solutions when using XCR3512XL-12FTG256C

XCR3512XL-12FTG256C is a field-programmable gate array (FPGA) known for its versatile applications in digital circuit design. However, it presents several common technical challenges that designers often encounter, including noise issues, power consumption concerns, and complexity of integration.

Noise Issues:

To address noise problems associated with XCR3512XL-12FTG256C, designers can employ various techniques such as proper grounding and decoupling capacitors placement. Additionally, signal integrity analysis using tools like time-domain reflectometry (TDR) can help identify and mitigate noise sources.

Power Consumption:

Reducing power consumption in XCR3512XL-12FTG256C designs involves optimizing the design for low-power modes, utilizing clock gating techniques, and employing power management IPs provided by the FPGA vendor. Furthermore, implementing dynamic voltage and frequency scaling (DVFS) techniques can help tailor power consumption to workload requirements.

Integration Complexity:

Integrating XCR3512XL-12FTG256C into a larger system can be complex due to the interactions between FPGA logic, external interfaces, and other system components. To simplify integration, designers should follow modular design practices, use standardized communication protocols like SPI or I2C, and employ design abstraction techniques such as hierarchical design and IP reuse.

High-Speed Design:

When working with XCR3512XL-12FTG256C in high-speed applications, careful consideration must be given to signal integrity and timing closure. Utilize tools like signal integrity simulation and timing analysis to ensure proper operation at high frequencies. Techniques like clock domain crossing synchronization and proper board layout can also help maintain signal integrity.

Testing and Verification:

Thorough testing and verification are crucial for ensuring the correctness and reliability of XCR3512XL-12FTG256C designs. Employ simulation and emulation tools for functional verification, and utilize on-chip resources like built-in self-test (BIST) features for comprehensive testing. Additionally, implementing robust error detection and correction mechanisms can enhance the reliability of the design.

XCR3512XL-12FTG256C FAQ

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3. Are the XCR3512XL-12FTG256C price and inventory displayed accurate?

The price and inventory of XCR3512XL-12FTG256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3512XL-12FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-12FTG256C we delivered, we will accept the replacement or return of the XCR3512XL-12FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-12FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations