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Name: XCR3512XL-12FT256I
Brand: AMD Xilinx
SKU: XCR3512XL-12FT256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-12FT256I

Part No.:: XCR3512XL-12FT256I

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3512XL-12FT256I.pdf

Description:: IC CPLD 512MC 10.8NS 256BGA

In Stock:: 2952

Quantity:: Add To Cart

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XCR3512XL-12FT256I Specifications

Package/Case:
256-LBGA
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
212
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3512XL-12FT256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-12FT256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-12FT256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-12FT256I information

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Common technical challenges and solutions when using XCR3512XL-12FT256I

XCR3512XL-12FT256I is a field-programmable gate array (FPGA) manufactured by Xilinx, offering high logic capacity and versatile functionality for various digital design applications.

Technical Challenges:

When utilizing XCR3512XL-12FT256I, several technical challenges may arise, including:

1. Noise Issues: High-speed digital circuits often encounter noise issues, affecting signal integrity and system performance. Mitigating techniques such as proper grounding, signal termination, and using differential signaling can reduce noise interference.

2. Power Consumption: FPGAs like XCR3512XL-12FT256I can consume significant power, especially in complex designs or high-speed operation. Power optimization strategies such as clock gating, power gating, and low-power design techniques should be employed to minimize power consumption.

3. Integration Complexity: Integrating XCR3512XL-12FT256I into a larger system may pose challenges in terms of design complexity, resource utilization, and timing constraints. Utilizing advanced design methodologies like hierarchical design, IP integration, and timing closure techniques can simplify integration and improve design efficiency.

4. Timing Closure: Achieving timing closure in FPGA designs, especially with high logic utilization like XCR3512XL-12FT256I, can be challenging due to complex interconnects and timing constraints. Techniques such as pipelining, register retiming, and floorplanning should be employed to meet timing requirements and ensure reliable operation.

5. Signal Integrity: Maintaining signal integrity is crucial for reliable operation of XCR3512XL-12FT256I-based designs, especially in high-speed interfaces. Signal integrity analysis, transmission line design, and impedance matching techniques should be implemented to minimize signal distortion and ensure robust communication.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvements:

- Noise Mitigation: Implement proper PCB layout techniques, utilize ground and power planes, and employ differential signaling for noise-immune communication.

- Power Optimization: Utilize power-saving features of the FPGA, optimize clock networks, and employ dynamic voltage and frequency scaling (DVFS) techniques to minimize power consumption.

- Design Methodologies: Adopt hierarchical design practices, use pre-designed IP blocks, and perform extensive simulation and verification to streamline integration and reduce complexity.

- Timing Closure Techniques: Employ aggressive optimization strategies, perform static timing analysis (STA), and utilize FPGA-specific synthesis and place-and-route optimizations to achieve timing closure.

- Signal Integrity Analysis: Perform signal integrity simulations, utilize high-speed design guidelines, and employ signal integrity tools for impedance matching and signal integrity validation.

By addressing these challenges and implementing appropriate solutions, designers can effectively utilize XCR3512XL-12FT256I in their digital designs while ensuring performance, reliability, and efficiency.

XCR3512XL-12FT256I FAQ

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3. Are the XCR3512XL-12FT256I price and inventory displayed accurate?

The price and inventory of XCR3512XL-12FT256I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3512XL-12FT256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-12FT256I we delivered, we will accept the replacement or return of the XCR3512XL-12FT256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-12FT256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations