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Name: XCR3512XL-12FG324I
Brand: AMD Xilinx
SKU: XCR3512XL-12FG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-12FG324I

Part No.:: XCR3512XL-12FG324I

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XCR3512XL-12FG324I.pdf

Description:: IC CPLD 512MC 10.8NS 324BGA

In Stock:: 2968

Quantity:: Add To Cart

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XCR3512XL-12FG324I Specifications

Package/Case:
324-BBGA
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
260
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3512XL-12FG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-12FG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-12FG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-12FG324I information

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Common technical challenges and solutions when using XCR3512XL-12FG324I

XCR3512XL-12FG324I is a field-programmable gate array (FPGA) chip commonly used in digital logic design and electronic systems prototyping. It offers flexible reconfigurability and high-performance computing capabilities.

Technical Challenges:

When utilizing XCR3512XL-12FG324I in electronic designs, several technical challenges may arise:

1. Noise Issues: High-speed digital circuits on XCR3512XL-12FG324I can generate electromagnetic interference (EMI), leading to signal integrity problems and noise coupling between neighboring components.

2. Power Consumption: The dynamic power consumption of XCR3512XL-12FG324I can be significant, especially when operating at high clock frequencies or when driving a large number of logic elements concurrently.

3. Integration Complexity: Designing complex systems with XCR3512XL-12FG324I involves managing multiple I/O interfaces, memory blocks, and logic resources, leading to integration challenges and routing congestion.

Solutions and Improvements:

1. Noise Mitigation: Implement proper PCB layout techniques, such as ground plane separation, signal routing optimization, and shielding, to minimize noise propagation and EMI effects. Additionally, utilize decoupling capacitors and ferrite beads to filter out high-frequency noise.

2. Power Optimization: Utilize power-saving techniques, such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS), to reduce the overall power consumption of XCR3512XL-12FG324I without compromising performance.

3. Integration Streamlining: Employ hierarchical design methodologies, modularization, and IP reuse to simplify system integration and reduce design complexity. Utilize advanced synthesis and place-and-route tools to optimize resource utilization and minimize routing congestion.

4. Thermal Management: Implement effective thermal management strategies, such as heat sinks, fans, or thermal vias, to dissipate heat generated by XCR3512XL-12FG324I and prevent overheating issues, which can affect reliability and performance.

5. Design Verification: Perform comprehensive functional verification, timing analysis, and simulation testing to ensure the reliability, robustness, and compliance of the XCR3512XL-12FG324I-based system with design specifications and standards.

XCR3512XL-12FG324I FAQ

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3. Are the XCR3512XL-12FG324I price and inventory displayed accurate?

The price and inventory of XCR3512XL-12FG324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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5. How is the shipping arranged?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCR3512XL-12FG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-12FG324I we delivered, we will accept the replacement or return of the XCR3512XL-12FG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-12FG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations