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Name: XCR3512XL-10FTG256I
Brand: AMD Xilinx
SKU: XCR3512XL-10FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-10FTG256I

Part No.:: XCR3512XL-10FTG256I

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3512XL-10FTG256I.pdf

Description:: IC CPLD 512MC 9NS 256BGA

In Stock:: 2894

Quantity:: Add To Cart

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XCR3512XL-10FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
212
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3512XL-10FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-10FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-10FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-10FTG256I information

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Common technical challenges and solutions when using XCR3512XL-10FTG256I

XCR3512XL-10FTG256I is a FPGA device commonly used in high-performance computing and communication applications. It offers a high logic capacity and a wide range of features suitable for complex system designs.

Noise Challenges:

One common challenge when using XCR3512XL-10FTG256I is managing noise in the system. This can arise from various sources such as power supply fluctuations, signal crosstalk, and external interference.

Solution:

To mitigate noise issues, implement proper power supply decoupling techniques using capacitors placed strategically near the FPGA. Utilize differential signaling for critical high-speed interfaces to minimize the impact of signal crosstalk. Additionally, employ shielding and grounding techniques to reduce susceptibility to external interference.

Power Consumption:

Another challenge is managing power consumption, especially in applications where energy efficiency is crucial.

Improvement:

Optimize the FPGA design to minimize unnecessary logic and routing resources. Utilize power-saving modes available in the FPGA architecture and implement dynamic power management techniques to reduce overall power consumption during idle or low activity periods.

Complex Integration:

Designing complex systems with XCR3512XL-10FTG256I can pose integration challenges due to the multitude of peripherals and interfaces that need to be coordinated.

Approach:

Utilize modular design methodologies to break down the system into manageable blocks. Employ standard communication protocols and interface standards to facilitate interoperability between different modules. Additionally, utilize simulation and verification tools to ensure seamless integration and functionality of the entire system.

Timing Closure:

Ensuring timing closure, especially in high-speed designs, can be a significant challenge with XCR3512XL-10FTG256I, where meeting stringent timing requirements is crucial.

Strategy:

Implement proper clock domain crossing techniques and utilize advanced synthesis and place-and-route optimizations to meet timing constraints. Perform thorough timing analysis and iteration during the design phase to identify and address any critical paths early in the development cycle.

Signal Integrity:

Maintaining signal integrity is essential for reliable operation, especially in high-speed interfaces, which can be challenging with XCR3512XL-10FTG256I.

Resolution:

Optimize PCB layout to minimize signal reflections and impedance mismatches. Use impedance-controlled traces and proper termination techniques to improve signal integrity. Perform signal integrity analysis using simulation tools to validate the design and ensure compliance with interface specifications.

XCR3512XL-10FTG256I FAQ

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The price and inventory of XCR3512XL-10FTG256I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3512XL-10FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-10FTG256I we delivered, we will accept the replacement or return of the XCR3512XL-10FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-10FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations