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Name: XCR3512XL-10FT256C
Brand: AMD Xilinx
SKU: XCR3512XL-10FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3512XL-10FT256C

Part No.:: XCR3512XL-10FT256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3512XL-10FT256C.pdf

Description:: IC CPLD 512MC 9NS 256BGA

In Stock:: 3160

Quantity:: Add To Cart

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XCR3512XL-10FT256C Specifications

Package/Case:
256-LBGA
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3512XL-10FT256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-10FT256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-10FT256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-10FT256C information

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Common technical challenges and solutions when using XCR3512XL-10FT256C

XCR3512XL-10FT256C is a field-programmable gate array (FPGA) device manufactured by Xilinx, offering versatile programmable logic capabilities for various applications.

Common Technical Challenges:

When using XCR3512XL-10FT256C, several technical challenges may arise, including:

1. Noise Issues: FPGA designs are susceptible to noise due to high-speed signal transitions and dense routing. Noise can adversely affect signal integrity and system performance.

2. Power Consumption: FPGA devices like XCR3512XL-10FT256C can consume significant power, especially when operating at high frequencies or with complex logic designs. Managing power consumption is crucial for energy efficiency and thermal management.

3. Integration Complexity: Integrating XCR3512XL-10FT256C into a larger system involves dealing with complex interfaces, compatibility issues, and synchronization challenges, especially in heterogeneous environments.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvement methods:

1. Noise Mitigation Techniques: Implement proper PCB layout practices, including signal isolation, ground plane partitioning, and impedance matching, to reduce noise susceptibility. Utilize differential signaling and termination resistors to improve signal integrity.

2. Power Optimization Strategies: Employ power gating techniques, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption during idle or low-utilization periods. Optimize logic synthesis and placement to minimize dynamic power dissipation.

3. System-Level Integration: Use standardized interfaces like AXI or PCIe for seamless integration with other system components. Leverage FPGA partial reconfiguration capabilities to dynamically adapt to changing system requirements and facilitate interoperability.

4. Design Verification and Validation: Conduct thorough simulation and testing using tools like ModelSim or Vivado Simulator to verify design functionality, timing constraints, and power consumption estimates. Perform hardware-in-the-loop (HIL) testing to validate system performance under real-world conditions.

5. Design for Reliability: Implement fault-tolerant design techniques such as triple modular redundancy (TMR) or error correction codes (ECC) to enhance system resilience against transient errors and ensure reliable operation over the device's lifespan.

Conclusion:

By addressing noise, power, and integration challenges through appropriate design methodologies and optimization techniques, developers can harness the full potential of XCR3512XL-10FT256C FPGA devices in diverse applications while ensuring robust performance and reliability.

XCR3512XL-10FT256C FAQ

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3. Are the XCR3512XL-10FT256C price and inventory displayed accurate?

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6. What is the process for return or replacement of XCR3512XL-10FT256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-10FT256C we delivered, we will accept the replacement or return of the XCR3512XL-10FT256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-10FT256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations