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Name: XCR3512XL-10FGG324I
Brand: AMD Xilinx
SKU: XCR3512XL-10FGG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3512XL-10FGG324I

Part No.:: XCR3512XL-10FGG324I

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XCR3512XL-10FGG324I.pdf

Description:: IC CPLD 512MC 9NS 324BGA

In Stock:: 3684

Quantity:: Add To Cart

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XCR3512XL-10FGG324I Specifications

Package/Case:
324-BBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
260
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3512XL-10FGG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3512XL-10FGG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3512XL-10FGG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3512XL-10FGG324I information

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Common technical challenges and solutions when using XCR3512XL-10FGG324I

XCR3512XL-10FGG324I is a field-programmable gate array (FPGA) manufactured by Xilinx, offering high-density programmable logic with low power consumption and high performance.

Technical Challenges:

When using XCR3512XL-10FGG324I, several technical challenges may arise, including:

1. Noise Issues: FPGA designs often encounter noise issues due to high-speed switching signals and complex routing. This can lead to timing violations and signal integrity problems.

2. Power Consumption: As FPGAs become more complex and packed with features, managing power consumption becomes crucial, especially in applications with strict power budgets or battery-powered devices.

3. Integration Complexity: Integrating XCR3512XL-10FGG324I into a larger system can be challenging due to its complex architecture, requiring careful consideration of interfacing with other components and peripherals.

4. Timing Closure: Achieving timing closure, ensuring that all timing constraints are met, can be difficult in FPGA designs, particularly for designs with high clock frequencies or complex logic paths.

5. Resource Utilization: Optimizing the utilization of resources within XCR3512XL-10FGG324I to maximize performance and minimize area usage can be a significant challenge, particularly for large designs with numerous logic elements and memory blocks.

Solutions and Improvements:

To address these challenges when using XCR3512XL-10FGG324I, consider the following solutions and improvements:

1. Noise Mitigation: Implement proper signal integrity techniques such as impedance matching, termination schemes, and careful PCB layout to minimize noise and ensure reliable operation.

2. Power Optimization: Utilize power optimization strategies such as clock gating, power gating, and voltage scaling to reduce overall power consumption without sacrificing performance.

3. Integration Simplification: Use standardized interfaces and communication protocols to simplify integration with other system components, and employ modular design practices to manage complexity.

4. Timing Closure Techniques: Employ design optimization techniques such as pipelining, retiming, and constraint adjustments to facilitate timing closure and meet performance requirements.

5. Resource Utilization Optimization: Utilize synthesis and optimization tools effectively to optimize resource usage, minimize logic duplication, and maximize the efficiency of XCR3512XL-10FGG324I utilization.

Considerations:

- Thorough Testing: Conduct comprehensive testing and verification throughout the design process to identify and address any potential issues early on.

- Design Reviews: Regular design reviews involving stakeholders and experts can help identify potential issues and ensure design robustness and reliability.

- Continuous Learning: Stay updated with the latest FPGA design techniques, tools, and methodologies to leverage advancements and improve design efficiency.

XCR3512XL-10FGG324I FAQ

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3. Are the XCR3512XL-10FGG324I price and inventory displayed accurate?

The price and inventory of XCR3512XL-10FGG324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3512XL-10FGG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3512XL-10FGG324I we delivered, we will accept the replacement or return of the XCR3512XL-10FGG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3512XL-10FGG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations