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Name: XCR3384XL-7FT256C
Brand: AMD Xilinx
SKU: XCR3384XL-7FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3384XL-7FT256C

Part No.:: XCR3384XL-7FT256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3384XL-7FT256C.pdf

Description:: IC CPLD 384MC 7NS 256BGA

In Stock:: 3058

Quantity:: Add To Cart

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XCR3384XL-7FT256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
7 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3384XL-7FT256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-7FT256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-7FT256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-7FT256C information

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Common technical challenges and solutions when using XCR3384XL-7FT256C

XCR3384XL-7FT256C is a programmable logic device (PLD) commonly used in various digital applications, offering high logic density and flexibility in design.

Technical Challenges:

When utilizing XCR3384XL-7FT256C, several technical challenges may arise, including:

1. Noise Issues: High-speed digital circuits can introduce noise, affecting signal integrity and system performance. Implementing proper signal conditioning techniques and utilizing decoupling capacitors can mitigate noise problems.

2. Power Consumption: PLDs like XCR3384XL-7FT256C may consume significant power, especially in complex designs or during high-frequency operation. Employing power-saving strategies such as clock gating, power supply optimization, and low-power design techniques can help reduce power consumption.

3. Integration Complexity: Integrating multiple functions within a single XCR3384XL-7FT256C device can lead to complexity in design, routing, and timing closure. Utilizing hierarchical design methodologies, floorplanning, and advanced synthesis optimization tools can address integration challenges.

4. Timing Closure: Meeting timing constraints in large designs can be challenging, especially when dealing with high-speed interfaces or complex logic paths. Employing techniques such as pipelining, retiming, and careful placement and routing can help achieve timing closure.

5. Temperature Considerations: Operating XCR3384XL-7FT256C in harsh environments or under varying temperature conditions may impact device performance and reliability. Implementing thermal management techniques such as heat sinks, thermal vias, and proper airflow can address temperature-related issues.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvements:

- Noise Mitigation: Use proper grounding techniques, isolation, and shielding to minimize noise interference. Implement differential signaling and impedance matching for high-speed interfaces.

- Power Optimization: Employ clock gating, voltage scaling, and dynamic power management techniques to reduce power consumption without compromising performance. Utilize power analysis tools for optimizing power distribution networks.

- Design Abstraction: Utilize higher-level design methodologies such as IP cores, HLS (High-Level Synthesis), and RTL (Register Transfer Level) optimizations to simplify design complexity and improve productivity.

- Timing Closure Techniques: Utilize timing-driven synthesis, physical synthesis, and FPGA-specific optimization tools to achieve timing closure efficiently. Perform thorough timing analysis and utilize constraints to guide the synthesis and place-and-route processes.

- Reliability Enhancements: Implement fault-tolerant design techniques, redundancy, and error correction mechanisms to enhance device reliability and robustness against environmental variations and aging effects.

By applying these strategies, designers can effectively overcome technical challenges associated with XCR3384XL-7FT256C and optimize the performance, power consumption, and reliability of their digital systems.

XCR3384XL-7FT256C FAQ

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3. Are the XCR3384XL-7FT256C price and inventory displayed accurate?

The price and inventory of XCR3384XL-7FT256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3384XL-7FT256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-7FT256C we delivered, we will accept the replacement or return of the XCR3384XL-7FT256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-7FT256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations