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Name: XCR3384XL-12TQG144C
Brand: AMD Xilinx
SKU: XCR3384XL-12TQG144C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3384XL-12TQG144C

Part No.:: XCR3384XL-12TQG144C

Manufacturer:: AMD Xilinx

Package:: 144-LQFP

Datasheet:: XCR3384XL-12TQG144C.pdf

Description:: IC CPLD 384MC 10.8NS 144QFP

In Stock:: 3097

Quantity:: Add To Cart

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XCR3384XL-12TQG144C Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
118
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3384XL-12TQG144C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-12TQG144C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-12TQG144C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-12TQG144C information

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Common technical challenges and solutions when using XCR3384XL-12TQG144C

XCR3384XL-12TQG144C is a Field-Programmable Gate Array (FPGA) chip known for its high-performance capabilities and flexibility in various digital applications.

Technical Challenges:

When utilizing XCR3384XL-12TQG144C in a design, several technical challenges may arise, including:

1. Power Consumption: Managing the power consumption of XCR3384XL-12TQG144C is crucial, especially in battery-powered or energy-efficient devices, to ensure optimal performance without draining excessive power.

2. Signal Integrity: Maintaining signal integrity is vital for reliable communication and operation within the FPGA. High-speed designs can suffer from signal integrity issues like reflections, crosstalk, and jitter, affecting overall system performance.

3. Thermal Management: As XCR3384XL-12TQG144C operates, it generates heat, which must be efficiently dissipated to prevent overheating and ensure long-term reliability. Inadequate thermal management can lead to performance degradation or even permanent damage to the FPGA.

4. Design Complexity: The complexity of integrating XCR3384XL-12TQG144C into a system can pose challenges in terms of design, verification, and debugging. Ensuring proper design methodologies and tools are employed is essential to manage complexity effectively.

5. Noise Immunity: XCR3384XL-12TQG144C designs must be resilient to noise sources, including electromagnetic interference (EMI) and power supply fluctuations, to maintain reliable operation and prevent erroneous behavior.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvements:

- Power Optimization Techniques: Implement power-saving strategies such as clock gating, voltage scaling, and dynamic power management to minimize XCR3384XL-12TQG144C's power consumption without sacrificing performance.

- High-Speed Design Best Practices: Follow best practices in high-speed PCB layout, impedance matching, and signal termination to enhance signal integrity and reduce the risk of signal integrity issues in XCR3384XL-12TQG144C designs.

- Thermal Analysis and Cooling: Conduct thermal analysis to identify hotspots and optimize thermal management solutions, including heatsinks, thermal vias, and airflow, to ensure XCR3384XL-12TQG144C operates within safe temperature limits.

- Design Abstraction and Automation: Utilize higher-level design abstractions and automation tools to simplify XCR3384XL-12TQG144C integration, verification, and debug processes, reducing design complexity and time-to-market.

- EMI/EMC Mitigation: Employ shielding, filtering, and grounding techniques to mitigate EMI/EMC issues and enhance XCR3384XL-12TQG144C's noise immunity in electromagnetic environments.

- Comprehensive Testing and Validation: Perform thorough testing and validation, including functional testing, stress testing, and environmental testing, to verify XCR3384XL-12TQG144C's performance, reliability, and robustness under various operating conditions.

XCR3384XL-12TQG144C FAQ

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6. What is the process for return or replacement of XCR3384XL-12TQG144C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-12TQG144C we delivered, we will accept the replacement or return of the XCR3384XL-12TQG144C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-12TQG144C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations