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Name: XCR3384XL-12TQ144I
Brand: AMD Xilinx
SKU: XCR3384XL-12TQ144I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3384XL-12TQ144I

Part No.:: XCR3384XL-12TQ144I

Manufacturer:: AMD Xilinx

Package:: 100-LQFP

Datasheet:: XCR3384XL-12TQ144I.pdf

Description:: IC CPLD 384MC 10.8NS 144QFP

In Stock:: 2255

Quantity:: Add To Cart

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XCR3384XL-12TQ144I Specifications

Package/Case:
100-LQFP
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
118
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3384XL-12TQ144I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-12TQ144I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-12TQ144I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-12TQ144I information

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Common technical challenges and solutions when using XCR3384XL-12TQ144I

XCR3384XL-12TQ144I is a field-programmable gate array (FPGA) chip commonly used in various electronic applications, presenting several technical challenges that engineers may encounter during its implementation.

Noise Issues:

One common challenge when working with XCR3384XL-12TQ144I is managing noise in the system. This can arise due to high-frequency switching activities within the FPGA, leading to electromagnetic interference (EMI) and impacting the performance of neighboring components. To mitigate this, engineers can employ techniques such as proper PCB layout design, incorporating decoupling capacitors near power pins, and utilizing ground planes to reduce noise coupling.

Power Consumption:

Another challenge is managing power consumption, especially in applications where energy efficiency is crucial. To address this, engineers can optimize the FPGA's configuration to minimize unnecessary power consumption, utilize power gating techniques to selectively power down unused portions of the device, and implement dynamic voltage and frequency scaling (DVFS) mechanisms to adjust power levels based on workload requirements.

Complexity of Integration:

Integrating XCR3384XL-12TQ144I into a system can be complex due to its extensive configurability and the need to interface with other components effectively. One approach to simplify integration is to utilize vendor-provided IP cores and development tools to accelerate the design process and ensure compatibility with the FPGA. Additionally, modularizing the design and adopting standardized communication protocols can facilitate interoperability with external components and subsystems.

High-Speed Interfaces:

In applications requiring high-speed data transfer, maintaining signal integrity across XCR3384XL-12TQ144I interfaces can be challenging. Engineers can address this by carefully designing transmission lines to match impedance, minimizing reflections and signal distortions. Using differential signaling and incorporating termination resistors can also help mitigate signal integrity issues, ensuring reliable communication at high data rates.

Temperature Management:

Effective temperature management is crucial for ensuring the reliable operation and longevity of XCR3384XL-12TQ144I in various environments. Engineers can employ thermal analysis techniques to identify hotspots on the FPGA die and implement heat dissipation strategies such as heatsinks, thermal vias, and fans to maintain optimal operating temperatures. Additionally, monitoring the temperature in real-time and implementing thermal throttling mechanisms can prevent overheating and potential damage to the device.

XCR3384XL-12TQ144I FAQ

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3. Are the XCR3384XL-12TQ144I price and inventory displayed accurate?

The price and inventory of XCR3384XL-12TQ144I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3384XL-12TQ144I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-12TQ144I we delivered, we will accept the replacement or return of the XCR3384XL-12TQ144I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-12TQ144I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations