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Name: XCR3384XL-12FTG256C
Brand: AMD Xilinx
SKU: XCR3384XL-12FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3384XL-12FTG256C

Part No.:: XCR3384XL-12FTG256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3384XL-12FTG256C.pdf

Description:: IC CPLD 384MC 10.8NS 256BGA

In Stock:: 3363

Quantity:: Add To Cart

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XCR3384XL-12FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3384XL-12FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-12FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-12FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-12FTG256C information

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Common technical challenges and solutions when using XCR3384XL-12FTG256C

XCR3384XL-12FTG256C is a Field Programmable Gate Array (FPGA) chip commonly used in digital signal processing, communication systems, and other high-performance computing applications.

Noise Issues:

To address noise issues when using XCR3384XL-12FTG256C, implement proper signal integrity techniques such as impedance matching, controlled impedance routing, and ground/power plane partitioning. Utilize differential signaling and termination resistors to minimize noise coupling and ensure reliable communication between components.

Power Consumption:

Optimize power consumption of XCR3384XL-12FTG256C by employing power gating techniques, clock gating, and dynamic voltage and frequency scaling (DVFS). Utilize low-power design methodologies such as clock domain partitioning and state retention during standby modes to reduce overall power consumption without compromising performance.

Integration Complexity:

Simplify integration of XCR3384XL-12FTG256C into the system by utilizing pre-designed intellectual property (IP) cores for common functions such as UART, SPI, and I2C interfaces. Implement modular design practices to partition the design into smaller, manageable blocks, and utilize hierarchical design methodologies to streamline integration and verification processes.

Temperature Management:

Ensure proper thermal management of XCR3384XL-12FTG256C by implementing heat sinks, thermal vias, and proper airflow within the system enclosure. Monitor the temperature of the FPGA using built-in temperature sensors or external sensors and implement dynamic thermal management algorithms to adjust operating parameters based on temperature conditions, such as clock frequency scaling or power reduction strategies.

Reliability and Testing:

Ensure reliability of XCR3384XL-12FTG256C by performing thorough functional verification and timing analysis using simulation tools and hardware-in-the-loop testing. Implement built-in self-test (BIST) features within the FPGA design to facilitate on-chip testing and fault detection during operation. Perform accelerated life testing to validate the reliability of the FPGA under various environmental conditions and operating scenarios.

XCR3384XL-12FTG256C FAQ

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3. Are the XCR3384XL-12FTG256C price and inventory displayed accurate?

The price and inventory of XCR3384XL-12FTG256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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6. What is the process for return or replacement of XCR3384XL-12FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-12FTG256C we delivered, we will accept the replacement or return of the XCR3384XL-12FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-12FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations