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Name: XCR3384XL-10TQG144I
Brand: AMD Xilinx
SKU: XCR3384XL-10TQG144I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3384XL-10TQG144I

Part No.:: XCR3384XL-10TQG144I

Manufacturer:: AMD Xilinx

Package:: 144-LQFP

Datasheet:: XCR3384XL-10TQG144I.pdf

Description:: IC CPLD 384MC 9NS 144QFP

In Stock:: 3638

Quantity:: Add To Cart

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XCR3384XL-10TQG144I Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
118
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3384XL-10TQG144I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-10TQG144I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-10TQG144I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-10TQG144I information

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Common technical challenges and solutions when using XCR3384XL-10TQG144I

XCR3384XL-10TQG144I is a field-programmable gate array (FPGA) chip commonly used in a variety of electronic systems for its flexibility and programmability. However, its usage can present several technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

One common challenge when using XCR3384XL-10TQG144I is managing noise in the system. To mitigate this issue, designers can employ techniques such as proper PCB layout and grounding, signal shielding, and the use of filtering components like ferrite beads and capacitors. Additionally, careful signal routing and minimizing signal reflections can help reduce noise interference.

Power Consumption:

Another significant concern with XCR3384XL-10TQG144I is power consumption, especially in applications where energy efficiency is critical. To address this, designers should optimize the FPGA configuration to minimize unnecessary power usage, utilize power gating techniques to selectively power down unused logic blocks, and implement dynamic voltage and frequency scaling (DVFS) strategies to adjust power levels based on workload demands.

Integration Complexity:

Integrating XCR3384XL-10TQG144I into a system can be complex due to its extensive configurability and the need to interface with other components. To simplify integration, designers can leverage comprehensive design tools provided by FPGA manufacturers, use standardized interfaces and protocols for communication, and modularize the system architecture to facilitate easier testing and debugging.

Temperature Management:

Effective temperature management is crucial for ensuring the reliable operation of XCR3384XL-10TQG144I, especially in environments with high thermal loads. Designers can employ thermal analysis tools to identify hotspots and optimize heat dissipation mechanisms such as heatsinks, fans, and thermal vias in the PCB layout. Additionally, implementing dynamic power management algorithms can help regulate temperature by adjusting FPGA activity based on thermal conditions.

Timing Closure:

Timing closure, ensuring that all signals meet timing requirements, is a significant challenge when designing with XCR3384XL-10TQG144I. Designers can address this by carefully optimizing the FPGA design, including pipelining critical paths, balancing logic utilization across resources, and utilizing advanced synthesis and place-and-route optimizations provided by FPGA design tools. Additionally, performing thorough timing analysis and simulation can help identify and resolve timing violations early in the design process.

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6. What is the process for return or replacement of XCR3384XL-10TQG144I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-10TQG144I we delivered, we will accept the replacement or return of the XCR3384XL-10TQG144I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-10TQG144I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations