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Name: XCR3384XL-10FTG256I
Brand: AMD Xilinx
SKU: XCR3384XL-10FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3384XL-10FTG256I

Part No.:: XCR3384XL-10FTG256I

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3384XL-10FTG256I.pdf

Description:: IC CPLD 384MC 9NS 256BGA

In Stock:: 3440

Quantity:: Add To Cart

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XCR3384XL-10FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
212
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3384XL-10FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3384XL-10FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3384XL-10FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3384XL-10FTG256I information

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Common technical challenges and solutions when using XCR3384XL-10FTG256I

XCR3384XL-10FTG256I is a field-programmable gate array (FPGA) with a large number of configurable logic blocks, commonly utilized in a variety of digital systems for tasks such as signal processing, communication, and control.

Noise Issues:

To address noise issues in XCR3384XL-10FTG256I designs, it's crucial to employ proper grounding techniques and layout practices. Implementing differential signaling and utilizing bypass capacitors near high-speed switching components can help mitigate noise interference.

Power Consumption Challenges:

Optimizing power consumption in XCR3384XL-10FTG256I designs involves careful selection of clock frequencies, power-saving modes utilization, and efficient coding practices. Utilizing clock gating techniques and power management features within the FPGA can significantly reduce overall power consumption.

Integration Complexity:

To manage integration complexity in XCR3384XL-10FTG256I designs, modularization and hierarchical design approaches can be employed. Breaking down the system into smaller functional blocks and utilizing standardized interfaces can simplify integration and enhance design scalability.

Signal Integrity:

Ensuring signal integrity in XCR3384XL-10FTG256I designs involves careful consideration of transmission line effects, termination techniques, and impedance matching. Employing simulation tools and performing thorough signal integrity analysis can help identify and mitigate potential issues.

Temperature Management:

Managing temperature in XCR3384XL-10FTG256I applications requires efficient thermal design and heat dissipation solutions. Utilizing heat sinks, thermal vias, and proper airflow within the system enclosure can help maintain optimal operating temperatures and prevent thermal throttling.

Considerations:

When designing with XCR3384XL-10FTG256I, it's essential to consider:

- Resource Utilization: Optimize FPGA resource usage to maximize design efficiency and minimize implementation overhead.

- Timing Constraints: Ensure proper timing closure by carefully managing clock domains and meeting setup and hold time requirements.

- Design Verification: Thoroughly verify the design functionality through simulation, emulation, and hardware testing to mitigate potential errors and ensure reliable operation.

- Design Security: Implement security features such as bitstream encryption and authentication to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Documentation: Maintain comprehensive documentation detailing the design specifications, constraints, and implementation details to facilitate future modifications and troubleshooting.

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6. What is the process for return or replacement of XCR3384XL-10FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3384XL-10FTG256I we delivered, we will accept the replacement or return of the XCR3384XL-10FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3384XL-10FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations