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Name: XCR3256XL-12FT256C
Brand: AMD Xilinx
SKU: XCR3256XL-12FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3256XL-12FT256C

Part No.:: XCR3256XL-12FT256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3256XL-12FT256C.pdf

Description:: IC CPLD 256MC 10.8NS 256BGA

In Stock:: 3223

Quantity:: Add To Cart

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XCR3256XL-12FT256C Specifications

Package/Case:
256-LBGA
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
10.8 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
164
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3256XL-12FT256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3256XL-12FT256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3256XL-12FT256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3256XL-12FT256C information

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Common technical challenges and solutions when using XCR3256XL-12FT256C

XCR3256XL-12FT256C is a field-programmable gate array (FPGA) chip known for its high logic density and versatile functionality, commonly used in a variety of digital design applications.

Noise Mitigation:

To mitigate noise issues in XCR3256XL-12FT256C designs, employ proper grounding techniques, including star grounding and using ground planes. Additionally, utilize bypass capacitors strategically across the power rails to suppress high-frequency noise.

Power Optimization:

Implement power-saving techniques such as clock gating and power gating to reduce dynamic and static power consumption in XCR3256XL-12FT256C designs. Utilize low-power design strategies during synthesis and optimization stages to minimize overall power usage.

Complexity Management:

Manage integration complexity in XCR3256XL-12FT256C designs by adopting modular design practices, such as hierarchical design and IP reuse. Utilize advanced synthesis and optimization tools to streamline the design process and optimize resource utilization.

Signal Integrity:

Ensure signal integrity in XCR3256XL-12FT256C designs by adhering to proper PCB layout guidelines, including controlled impedance routing and minimizing signal reflections. Perform thorough timing analysis and signal integrity simulations to identify and address potential issues.

Thermal Management:

Manage thermal issues in XCR3256XL-12FT256C designs by incorporating proper thermal management techniques, such as heat sinks, thermal vias, and airflow optimization. Monitor temperature levels during operation and implement dynamic thermal management strategies to prevent overheating.

Verification and Testing:

Ensure the reliability and functionality of XCR3256XL-12FT256C designs through rigorous verification and testing methodologies, including simulation-based verification, FPGA prototyping, and in-circuit testing. Perform comprehensive functional testing to validate design correctness and robustness.

XCR3256XL-12FT256C FAQ

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3. Are the XCR3256XL-12FT256C price and inventory displayed accurate?

The price and inventory of XCR3256XL-12FT256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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5. How is the shipping arranged?

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6. What is the process for return or replacement of XCR3256XL-12FT256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3256XL-12FT256C we delivered, we will accept the replacement or return of the XCR3256XL-12FT256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3256XL-12FT256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations